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参数资料
| 型号： | A25FR60 |
| 厂商： | International Rectifier |
| 英文描述： | STANDARD RECOVERY DIODES |
| 中文描述： | 标准恢复二极管 |
| 文件页数： | 2/6页 |
| 文件大小： | 80K |
| 代理商： | A25FR60 |
25F(R) Series
Bulletin I2018 rev. B 09/98
2
www.irf.com
Voltage
Code
V
RRM
, maximum
repetitive peak
reverse voltage
V
V
RSM
, maximum non-
repetitive peak
reverse voltage
V
V
R(BR)
, minimum
avalanche
voltage
V
I
RRM
max.
@ T
J
= 175°C
Type number
(1)
mA
10
20
100
200
150
275
--
--
40
60
80
100
120
400
600
800
1000
1200
500
725
950
1200
1400
500
750
950
1150
1350
25F(R)
12
ELECTRICAL SPECIFICATIONS
Voltage Ratings
I
F(AV)
Max. average forward current
@ Case temperature
I
F(RMS)
Max. RMS forward current
P
R
Maximum non-repetitive
peak reverse power
25
120
40
A
°C
A
180° conduction, half sine wave
10
K/W
10μs square pulse, T
J
= T
J
max.
see note (2)
I
FSM
Max. peak, one-cycle forward,
356
t = 10ms
No voltage
non-repetitive surge current
373
t = 8.3ms
reapplied
300
t = 10ms
100% V
RRM
reapplied
314
t = 8.3ms
Sinusoidal half wave,
I
2
t
Maximum I
2
t for fusing
636
t = 10ms
No voltage
Initial T
J
= T
J
max.
580
t = 8.3ms
reapplied
450
t = 10ms
100% V
RRM
410
t = 8.3ms
reapplied
I
2
√
t
V
F(TO)1
Low level value of threshold
voltage
Maximum I
2
√
t for fusing
6360
A
2
√
s
t = 0.1 to 10ms, no voltage reapplied
V
F(TO)2
High level value of threshold
voltage
r
f
1
Low level value of forward
slope resistance
r
f
2
High level value of forward
slope resistance
V
FM
Max. forward voltage drop
1.30
V
I
pk
= 78A, T
J
= 25°C, t
p
= 400μs rectangular wave
Parameter
25F(R)
Units Conditions
5.70
(I >
π
x I
F(AV)
), T
J
= T
J
max.
6.80
(16.7% x
π
x I
F(AV)
< I <
π
x I
F(AV)
), T
J
= T
J
max.
m
0.90
(I >
π
x I
F(AV)
), T
J
= T
J
max.
0.80
(16.7% x
π
x I
F(AV)
< I <
π
x I
F(AV)
), T
J
= T
J
max.
V
A
2
s
A
Forward Conduction
(2)
Available only for Avalanche version, all other parameters the same as 25F.
(1)
Avalanche version only available from V
RRM
400V to 1200V.
相关PDF资料 |
PDF描述 |
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| A25FR80 | Memory Card Socket; Number of Contacts:50; Pitch Spacing:0.635mm; Contact Termination:PCB SMT; Contact Material:Copper Alloy; Contact Plating:Gold Over Nickel; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No |
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相关代理商/技术参数 |
参数描述 |
|---|---|
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