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参数资料
| 型号： | A3908EEETR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 6/8页 |
| 文件大小： | 0K |
| 描述： | IC MOTOR DRIVER DC LV 500MA 8DFN |
| 标准包装： | 1 |
| 应用： | 直流电机驱动器 |
| 输出数： | 1 |
| 电流 - 输出： | 500mA |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-UFDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN/MLP（2x2） |
| 包装： | 标准包装 |
| 产品目录页面： | 1140 (CN2011-ZH PDF) |
| 其它名称： | 620-1282-6 |
A3908
Low Voltage DC Motor Driver
Application Information
Layout
The printed circuit board should use a heavy ground-
plane for optimum thermal performance. The A3908
must be soldered directly onto the board. On the
underside of the A3908 package is an exposed pad,
which provides a path for enhanced thermal dissipa-
tion. The thermal pad should be soldered directly to an
exposed surface on the PCB. Thermal vias are used to
transfer heat to other layers of the PCB. Thermal vias
should not have any thermal relief and should be con-
nected to internal layers, if available, to maximize the
dissipation area.
Grounding In order to minimize the effects of ground
bounce and offset issues, it is important to have a
low impedance, single-point ground, known as a star
ground , located very close to the device. By making
the connection between the exposed thermal pad and
the groundplane directly under the A3908, that area
becomes an ideal location for a star ground point. A
low impedance ground will prevent ground bounce
OUTB
GND
CVDD
U1
GND
IN2
VDD
IN1
OUTA
R2
R1
OUTB
IN2
GND
CVDD
10 F
GND
VDD
A3908
PAD
IN1
VREF
R1
OUTA
VSET
R2
A3908 Evaluation Board
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
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相关代理商/技术参数 |
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| A3909 | 制造商:ALLEGRO 制造商全称:Allegro MicroSystems 功能描述:Dual Full Bridge Motor Driver |
| A39093-000 | 制造商:TE Connectivity 功能描述:Cable Accessories Solder Sleeve Shield Termination Polyolefin Transparent Clear 制造商:TE Connectivity 功能描述:B-155-11 - Bulk |
| A-3909-632-0 | 制造商:MISC. SPCR/STNDF/HND 功能描述: |
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| A3909GLNTR-T | 功能描述:IC MOTOR DRIVER PAR 10SSOP 制造商:allegro microsystems, llc 系列:- 包装:剪切带（CT） 零件状态:有效 输出配置:半桥（4） 应用:DC 电机，通用，步进电机 接口:逻辑 负载类型:电感 技术:DMOS 导通电阻（典型值）:1.6 欧姆 LS + HS 电流 - 输出/通道:1A 电流 - 峰值输出:- 电压 - 电源:4 V ~ 18 V 电压 - 负载:4 V ~ 18 V 工作温度:-40°C ~ 150°C（TJ） 特性:- 故障保护:限流，超温 安装类型:表面贴装 封装/外壳:10-SOP（0.154"，3.90mm 宽） 供应商器件封装:10-SSOP 标准包装:1 |
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