参数资料
| 型号： | A3918SESTR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | IC MOTOR DRIVER DC 16QFN |
| 特色产品： | A3918 DC Motor Driver |
| 标准包装： | 1 |
| 应用： | 直流电机驱动器，PWM 电机驱动器 |
| 评估套件： | * |
| 输出数： | 1 |
| 电流 - 输出： | 1A |
| 电源电压： | 2.5 V ~ 9 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WFQFN 裸露焊盘 |
| 供应商设备封装： | 16-QFN（3x3） |
| 包装： | 标准包装 |
| 其它名称： | 620-1476-6 |
A3918
Layout The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3918 must be soldered directly onto the board. On the under-
side of the A3918 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
Grounding In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground , located very close to the
device. By making the connection between the exposed thermal
pad and the ground plane directly under the A3918, that area
becomes an ideal location for a star ground point. A low imped-
ance ground will prevent ground bounce during high current
operation and ensure that the supply voltage remains stable at
the input terminal. The recommended PCB layout shown in the
diagram below, illustrates how to create a star ground under the
device, to serve both as low impedance ground point and
thermal path.
Low Voltage DC Motor Driver
The two input capacitors should be placed in parallel, and as
close to the device supply pin as possible. The ceramic capaci-
tor should be closer to the pin than the bulk capacitor. This is
necessary because the ceramic capacitor will be responsible for
delivering the high frequency current components.
Sense Pin The sense resistor, R SENSE , should have a very low
impedance path to ground, because it must carry a large current
while supporting very accurate voltage measurements by the cur-
rent sense comparator. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparator to
accurately measure the current in the winding. As shown in the
layout below, the SENSE pin has very short traces to the R SENSE
resistor and very thick, low impedance traces directly to the star
ground underneath the device. If possible, there should be no
other components on the sense circuit.
Note: When selecting a value for the sense resistor, be sure not to
exceed the maximum voltage on the SENSE pin of ±500 mV.
A3918
Solder
Trace (2 oz.)
Signal (1 oz.)
PCB
Thermal Vias
C1
C2
Ground (1 oz.)
Thermal (2 oz.)
C3
C1
C2
C3
OUTA
SLEEP
SLEEP
R3
CP2
GND
SLEEP
A3918
PAD
OUTA
SENSE
OUTB
R4
R6
OUTB
IN1
R3
U1
R4
R6
OUTA
IN1
R1
IN1
VBB
VBB
IN2
R1
R2
C4
OUTB
IN2
R2
C4
C5
C6
VCCIO
R5
VCCIO
FL
GND
C5
C6
VBB
FL
GND
R5
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
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