参数资料
型号: A3979SLP
厂商: Allegro Microsystems Inc
文件页数: 5/15页
文件大小: 0K
描述: IC DRIVER MICROSTEPPING 28-TSSOP
标准包装: 50
应用: 步进电机驱动器
输出数: 1
电流 - 输出: ±2.5A
电压 - 负载: 8 V ~ 35 V
电源电压: 3 V ~ 5.5 V
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.173",4.40mm 宽)裸露焊盘
供应商设备封装: 28-TSSOP 裸露焊盘
包装: 管件
A3979
DMOS Microstepping Driver with Translator
ELECTRICAL CHARACTERISTICS, continued at T A = 25°C, V BB = 35 V, V DD = 3.0 to 5.5 V (unless otherwise noted)
Characteristics
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Symbol Test Conditions
T JSD
T JSDHYS
Min.
Typ. 1
165
15
Max.
Units
°C
°C
UVLO Enable Threshold
UVLO Hysteresis
V UVLO
V UVLOHYS
Increasing V DD
2.45
0.05
2.7
0.10
2.95
V
V
1 Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for
individual units, within the specified maximum and minimum limits.
2 Negative current is defined as coming out of (sourcing from) the specified device pin.
3 E
G = ( [ V REF / 8] – V SENSE ) / ( V REF / 8 ).
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Package Thermal Resistance
Symbol
R θ JA
Test Conditions*
Two-layer PCB with 3.8 in. 2 of copper area on each side
connected with thermal vias and to device exposed pad
High-K PCB (multilayer with significant copper areas,
based on JEDEC standard)
Value
32
28
Units
oC/W
oC/W
*Additional thermal information available on Allegro Web site.
Maximum Power Dissipation, P D(max)
5.0
4.5
(R i -
θ J
= PCB
oC
rP
(R C w
θ J ith
3 8
32 . in 2
/W c p
oC
4.0
3.5
3.0
2.5
2.0
1.5
2-
La
ye /W
H
gh
A
B
A =
K
28
)
)
op
er
p
er
sid
e
1.0
0.5
0.0
20
40
60
80 100 120
140
160
Temperature (°C)
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
5
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