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参数资料
| 型号： | A3987SLPTR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 11/13页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER MICROSTEPPING 24-TSSOP |
| 产品培训模块： | A3987 DMOS Microstepping |
| 标准包装： | 1 |
| 应用： | 步进电机驱动器 |
| 输出数： | 1 |
| 电流 - 输出： | ±1.5A |
| 电压 - 负载： | 8 V ~ 50 V |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm）裸露焊盘 |
| 供应商设备封装： | 24-TSSOP 裸露焊盘 |
| 包装： | 标准包装 |
| 产品目录页面： | 1141 (CN2011-ZH PDF) |
| 其它名称： | 620-1171-6 |
A3987
DMOS Microstepping Driver with Translator
Layout . The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3987 must be soldered directly onto the board. On the under-
side of the A3987 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground , located very close to the device.
By making the connection between the pad and the ground plane
directly under the A3987, that area becomes an ideal location
for a star ground point. A low impedance ground will prevent
ground bounce during high current operation and ensure that the
The sense resistors, RSx , should have a very low impedance path
to ground, because they must carry a large current while sup-
porting very accurate voltage measurements by the current sense
comparators. Long ground traces will cause additional voltage
drops, adversely affecting the ability of the comparators to accu-
rately measure the current in the windings. As shown in figure 8,
the SENSEx pins have very short traces to the RSx resistors
and very thick, low impedance traces directly to the star ground
underneath the device. If possible, there should be no other com-
ponents on the sense circuits.
supply voltage remains stable at the input terminal. The recom-
mended PCB layout, shown in figure 8, illustrates how to create
a star ground under the device, to serve both as a low impedance
ground point and thermal path.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
PCB
Thermal Vias
A3987
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
OUT1A
OUT1B
OUT1A
OUT1B
V IN
GND
VIN
RS1
1
SENSE1
VBB1
RS1
U1
OUT1A
NC
MS1
A3987
MS2
OUT1B
CP2
CCP
CCP
CVCP
DIR
STEP
PAD
CP1
VCP
CVCP
CREF
ROSC
CREF
GND
REF
ENABLE
VDD
GND
ROSC
SLEEP/RESET
VREG
ROSC
CREG
CIN2
CVDD
RS2
CIN2
RS2
OUT2A
SENSE2
OUT2B
VBB2
CIN1
CREG
CIN1
VREF
OUT2A
OUT2B
VREF
OUT2A
CVDD
OUT2B
Figure 8. Printed circuit board layout with typical application circuit,
shown at right. The copper area directly under the A3987 (U1) is
soldered to the exposed thermal pad on the underside of the device.
The thermal vias serve also as electrical vias, connecting it to the
ground plane on the other side of the PCB , so the two copper areas
together form the star ground.
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
11
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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