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参数资料
| 型号： | A3989SEVTR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | IC STEPPER/MOTOR DRIVER 36-QFN |
| 标准包装： | 1 |
| 应用： | 直流电机驱动器，步进电机驱动器 |
| 输出数： | 2 |
| 电压 - 负载： | 8 V ~ 36 V |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 36-VFQFN 裸露焊盘 |
| 供应商设备封装： | 36-QFN-EP（6x6） |
| 包装： | 标准包装 |
| 产品目录页面： | 1141 (CN2011-ZH PDF) |
| 其它名称： | 620-1183-6 |
A3989
Bipolar Stepper and High Current DC Motor Driver
EV Package, 36 Pin QFN with Exposed Thermal Pad
6.00 ±0.15
1.15
0.30
36
0.50
36
1
2
A
1
2
6.00 ±0.15
4.15
5.80
0.25 –0.07
D 37X
0.08 C
+0.05
0.50
SEATING
PLANE
0.90 ±0.10
C
4.15
5.80
All dimensions nominal, not for tooling use
(reference JEDEC MO-220VJJD-3, except pin count)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
0.55 ±0.20
2
1
36
4.15
B
4.15
A Terminal #1 mark area
B Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
C Reference land pattern layout (reference IPC7351
QFN50P600X600X100-37V1M); All pads a minimum of 0.20 mm from
all adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a
multilayer PCB, thermal vias at the exposed thermal pad land can
improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
D Coplanarity includes exposed thermal pad and terminals
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
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