参数资料
型号: A3PE3000-2FGG324I
厂商: Microsemi SoC
文件页数: 86/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
标准包装: 84
系列: ProASIC3E
RAM 位总计: 516096
输入/输出数: 221
门数: 3000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 324-BGA
供应商设备封装: 324-FBGA(19x19)
ProASIC3E Flash Family FPGAs
Revision 13
III
ProASIC3E Ordering Information
A3PE3000
FG
_
Part Number
Speed Grade
1
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Package Type
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
896
I
Y
Package Lead Count
Application (Temperature Range)
Blank = Commercial (0°C to +70°C Ambient Temperature)
I = Industrial (–40°C to +85°C Ambient Temperature)
PP = Pre-Production
ES = Engineering Sample (Room Temperature Only)
600,000 System Gates
A3PE600 =
1,500,000 System Gates
A3PE1500 =
3,000,000 System Gates
A3PE3000 =
1,500,000 System Gates
M1A3PE1500 =
3,000,000 System Gates
M1A3PE3000 =
G
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS-Compliant (Green) Packaging
ProASIC3E Devices
ProASIC3E Devices with Cortex-M1
Security Feature
Y = Device Includes License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio
Blank = Device Does Not Include License to Implement IP Based
on the Cryptography Research, Inc. (CRI) Patent Portfolio
相关PDF资料
PDF描述
ABB90DHND CONN EDGECARD 180PS .050 DIP SLD
IDT70T3539MS133BCI IC SRAM 18MBIT 133MHZ 256BGA
A1240A-1PLG84I IC FPGA 4K GATES 84-PLCC IND
AX1000-2BG729I IC FPGA AXCELERATOR 1M 729-PBGA
AX1000-2BGG729I IC FPGA AXCELERATOR 1M 729-PBGA
相关代理商/技术参数
参数描述
A3PE3000-2FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A3PE3000-2FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A3PE3000-2FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A3PE3000-2FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE3000-2FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)