参数资料
型号: A3PN030-Z1VQG100I
元件分类: FPGA
英文描述: FPGA, 768 CLBS, 30000 GATES, PQFP100
封装: 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
文件页数: 5/100页
文件大小: 3284K
代理商: A3PN030-Z1VQG100I
ProASIC3 nano Device Overview
1- 8
A d vance v0.6
Wide Range I/O Support
Actel nano devices support JEDEC-defined wide range I/O operation. ProASIC3 nano supports the
JESD8-B specification, covering both 3 V and 3.3 V supplies, for an effective operating range of
2.7 V to 3.6 V.
Wider I/O range means designers can eliminate power supplies or power conditioning components
from the board or move to less costly components with greater tolerances. Wide range eases I/O
bank management and provides enhanced protection from system voltage spikes, while providing
the flexibility to easily run custom voltage applications.
Part Number and Revision Date
Part Number 51700111-001-5
Revised January 2010
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous Version
Changes in Current Version (Advance v0.6)
Page
Advance v0.5
(August 2009)
The note for A3PN030 in the "ProASIC3 nano Devices" table was revised. It states
A3PN030 is available in the Z feature grade only.
Advance v0.4
(January 2009)
All references to speed grade –F were removed from this document.
N/A
The"I/Os with Advanced I/O Standards" section was revised to add definitions of
hot-swap and cold-sparing.
Advance v0.3
(November 2008)
Table 1 ProASIC3 nano Devices was revised to change the maximum user I/Os for
A3PN020 and A3PN030. The following table note was removed: "Six chip (main)
and three quadrant global networks are available for A3PN060 and above."
The QN100 package was removed for all devices.
N/A
Advance v0.2
(October 2008)
The A3PN030 device was added to product tables and replaces A3P030 entries
that were formerly in the tables.
I to IV
Advance v0.1
(October 2008)
The "I/Os Per Package" table was updated to add the following information to
table note 4: "For nano devices, the VQ100 package is offered in both leaded and
RoHS-compliant versions. All other packages are RoHS-compliant only."
updated to remove QN100 for A3PN250.
The "General Description" section was updated to give correct information
about number of gates and dual-port RAM for ProASIC3 nano devices.
The device architecture figures, Figure 1-3 ProASIC3 nano Device Architecture
through
through
The "PLL and CCC" section was revised to include information about CCC-GLs in
A3PN020 and smaller devices.
相关PDF资料
PDF描述
A3PN030-Z1VQG100 FPGA, 768 CLBS, 30000 GATES, PQFP100
A3PN030-Z2QNG48I FPGA, 768 CLBS, 30000 GATES, QCC48
A3PN030-Z2QNG48 FPGA, 768 CLBS, 30000 GATES, QCC48
A3PN030-Z2QNG68I FPGA, 768 CLBS, 30000 GATES, QCC68
A3PN030-Z2QNG68 FPGA, 768 CLBS, 30000 GATES, QCC68
相关代理商/技术参数
参数描述
A3PN030-Z2QNG48 功能描述:IC FPGA NANO 30K GATES 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN030-Z2QNG48I 功能描述:IC FPGA NANO 30K GATES 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN030-Z2QNG68 功能描述:IC FPGA NANO 30K GATES 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN030-Z2QNG68I 功能描述:IC FPGA NANO 30K GATES 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN030-Z2VQ100 功能描述:IC FPGA NANO 30K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)