参数资料
型号: A3PN125-2VQG100
元件分类: FPGA
英文描述: FPGA, 3072 CLBS, 125000 GATES, PQFP100
封装: 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
文件页数: 74/106页
文件大小: 3324K
代理商: A3PN125-2VQG100
R e visio n 8
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1 – ProASIC3 nano Device Overview
General Description
ProASIC3, the third-generation family of Actel flash FPGAs, offers performance, density, and features
beyond those of the ProASICPLUS family. Nonvolatile flash technology gives ProASIC3 nano devices
the advantage of being a secure, low power, single-chip solution that is live at power-up (LAPU).
ProASIC3 nano devices are reprogrammable and offer time-to-market benefits at an ASIC-level unit
cost. These features enable designers to create high-density systems using existing ASIC or FPGA
design flows and tools.
ProASIC3 nano devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well
as clock conditioning circuitry based on an integrated phase-locked loop (PLL). A3PN030 and smaller
devices do not have PLL or RAM support. ProASIC3 nano devices have up to 250,000 system gates,
supported with up to 36 kbits of true dual-port SRAM and up to 71 user I/Os.
ProASIC3 nano devices increase the breadth of the ProASIC3 product line by adding new features and
packages for greater customer value in high volume consumer, portable, and battery-backed markets.
Added features include smaller footprint packages designed with two-layer PCBs in mind, low power,
hot-swap capability, and Schmitt trigger for greater flexibility in low-cost and power-sensitive applications.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAM-
based FPGAs, flash-based ProASIC3 nano devices allow all functionality to be live at power-up; no
external boot PROM is required. On-board security mechanisms prevent access to all the programming
information and enable secure remote updates of the FPGA logic. Designers can perform secure remote
in-system reprogramming to support future design iterations and field upgrades with confidence that
valuable intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using
the industry-standard AES algorithm. The ProASIC3 nano device architecture mitigates the need for
ASIC migration at higher user volumes. This makes the ProASIC3 nano device a cost-effective ASIC
replacement solution, especially for applications in the consumer, networking/communications,
computing, and avionics markets.
With a variety of devices under $1, Actel ProASIC3 nano FPGAs enable cost-effective implementation of
programmable logic and quick time to market.
Security
Nonvolatile, flash-based ProASIC3 nano devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3 nano devices incorporate FlashLock, which
provides a unique combination of reprogrammability and design security without external overhead,
advantages that only an FPGA with nonvolatile flash programming can offer.
ProASIC3 nano devices utilize a 128-bit flash-based lock and a separate AES key to secure
programmed intellectual property and configuration data. In addition, all FlashROM data in ProASIC3
nano devices can be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block
cipher encryption standard. The AES standard was adopted by the National Institute of Standards and
Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3 nano devices have a built-in
AES decryption engine and a flash-based AES key that make them the most comprehensive
programmable logic device security solution available today. ProASIC3 nano devices with AES-based
security allow for secure, remote field updates over public networks such as the Internet, and ensure that
valuable IP remains out of the hands of system overbuilders, system cloners, and IP thieves. The
contents of a programmed ProASIC3 nano device cannot be read back, although secure design
verification is possible.
Security, built into the FPGA fabric, is an inherent component of ProASIC3 nano devices. The flash cells
are located beneath seven metal layers, and many device design and layout techniques have been used
相关PDF资料
PDF描述
A3PN125-VQ100I FPGA, 3072 CLBS, 125000 GATES, PQFP100
A3PN125-VQ100 FPGA, 3072 CLBS, 125000 GATES, PQFP100
A3PN125-VQG100I FPGA, 3072 CLBS, 125000 GATES, PQFP100
A3PN125-VQG100 FPGA, 3072 CLBS, 125000 GATES, PQFP100
A3PN125-Z1VQ100I FPGA, 3072 CLBS, 125000 GATES, PQFP100
相关代理商/技术参数
参数描述
A3PN125-2VQG100I 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN125-DIELOT 制造商:Microsemi Corporation 功能描述:A3PN125-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
A3PN125-VQ100 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN125-VQ100I 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN125-VQG100 功能描述:IC FPGA NANO 1024MAC 100VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241