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参数资料
型号： A40MX02-1PLG44
厂商： Microsemi SoC
文件页数： 45/142页
文件大小： 0K
描述： IC FPGA MX SGL CHIP 3K 44-PLCC
标准包装： 27
系列： MX
输入/输出数： 34
门数： 3000
电源电压： 3 V ~ 3.6 V，4.75 V ~ 5.25 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 44-LCC（J 形引线）
供应商设备封装： 44-PLCC（16.59x16.59）
Re vi s i on 11
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 11
(May 2012)
The FuseLock logo and accompanying text was removed from the "User Security"
section. This marking is no longer used on Microsemi devices (PCN 0915).
1-8
The "Development Tool Support" section was updated (SAR 38512).
1-16
Revision 10
(April 2012)
"Ordering Information" was updated to include lead-free package ordering codes
(SAR 21968).
ii
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement the best
security available in the industry (SAR 34673).
1-8
The "Transient Current" section is new (SAR 36930).
1-9
Package names were revised according to standards established in Package
Mechanical Drawings (SAR 34774).
2-1
Revision 9
(v6.1, April 2009)
In Table 1-14 Absolute Maximum Ratings*, the limits in VI were changed from -0.5 to
VCCI + 0.5 to -0.5 to VCCA + 0.5.
1-21
In Table 1-16 Mixed 5.0V/3.3V Electrical Specifications, VOH was changed from 3.7
to 2.4 for the min in industrial and military. VIH had VCCI and that was changed to
VCCA.
1-22
v6.0
(January 2004)
The "Ease of Integration" section was updated.
1-i
The "Temperature Grade Offerings" section is new.
1-iii
The "Speed Grade Offerings" section is new.
1-iii
The "General Description" section was updated.
1-1
The "MultiPlex I/O Modules" section was updated.
1-7
The "User Security" section was updated.
1-8
Table 1-1 Voltage Support of MX Devices was updated.
1-9
The "Power Dissipation" section was updated.
1-10
The "Static Power Component" section was updated.
1-10
The "Equivalent Capacitance" section was updated.
1-10
Figure 1-12 Silicon Explorer II Setup with 42MX was updated.
1-12
Table 1-4 Supported BST Public Instructions was updated.
1-14
Figure 1-13 42MX IEEE 1149.1 Boundary Scan Circuitry was updated.
1-14
Table 1-5 Boundary Scan Pin Configuration and Functionality was updated.
1-15
The "Development Tool Support" section was updated.
1-16
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相关代理商/技术参数
参数描述
A40MX02-1PLG44I 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
A40MX02-1PLG44M 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA 34 I/O 44PLCC
A40MX02-1PLG68 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
A40MX02-1PLG68I 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
A40MX02-1PLG68M 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 68PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA 57 I/O 68PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC
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