参数资料
型号: A40MX02-3PQ100
厂商: Microsemi SoC
文件页数: 61/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 3K 100-PQFP
标准包装: 66
系列: MX
输入/输出数: 57
门数: 3000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 100-BQFP
供应商设备封装: 100-PQFP(14x20)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 21
Mixed 5.0 V / 3.3 V Operating Conditions (for 42MX Devices
Only)
Table 1-14 Absolute Maximum Ratings*
Symbol
Parameter
Limits
Units
VCCI
DC Supply Voltage for I/Os
–0.5 to +7.0
V
VCCA
DC Supply Voltage for Array
–0.5 to +7.0
V
VI
Input Voltage
–0.5 to VCCA +0.5
V
VO
Output Voltage
–0.5 to VCCI + 0.5
V
tSTG
Storage Temperature
–65 to +150
°C
Note:
*Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Devices
should not be operated outside the Recommended Operating Conditions.
Table 1-15 Recommended Operating Conditions
Parameter
Commercial
Industrial
Military
Units
Temperature Range*
0 to +70
–40 to +85
–55 to +125
°C
VCCA
4.75 to 5.25
4.5 to 5.5
V
VCCI
3.14 to 3.47
3.0 to 3.6
V
Note:
*Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for
military grades.
相关PDF资料
PDF描述
M1AFS250-FG256 IC FPGA 2MB FLASH 250K 256-FBGA
M1AFS250-FGG256 IC FPGA 2MB FLASH 250K 256-FBGA
AFS250-FG256 IC FPGA 2MB FLASH 250K 256FBGA
M1AGL600V5-FGG144 IC FPGA 1KB FLASH 600K 144-FBGA
M1AGL600V5-FG144 IC FPGA 1KB FLASH 600K 144-FBGA
相关代理商/技术参数
参数描述
A40MX02-3PQ100I 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-3PQ100M 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA)
A40MX02-3PQG100 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-3PQG100I 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-3VQ80 功能描述:IC FPGA MX SGL CHIP 3K 80-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)