参数资料
型号: A40MX02-PLG44I
厂商: Microsemi SoC
文件页数: 50/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 3K 44-PLCC
标准包装: 27
系列: MX
输入/输出数: 34
门数: 3000
电源电压: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 44-LCC(J 形引线)
供应商设备封装: 44-PLCC(16.59x16.59)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 11
CEQ Values for Microsemi MX FPGAs
Modules (CEQM)3.5
Input Buffers (CEQI)6.9
Output Buffers (CEQO)18.2
Routed Array Clock Buffer Loads (CEQCR)1.4
To calculate the active power dissipated from the complete design, the switching frequency of each part
of the logic must be known. The equation below shows a piece-wise linear summation over all
components.
Power = VCCA2 * [(m x
CEQM * fm)Modules +
(n *
CEQI * fn)Inputs + (p * (CEQO + CL) * fp)outputs +
0.5 * (q1 * CEQCR * fq1)routed_Clk1 + (r1 * fq1)routed_Clk1 +
0.5 * (q2 * CEQCR * fq2)routed_Clk2 + (r2 * fq2)routed_Clk2 (2)
where:
Fixed Capacitance Values for MX FPGAs (pF)
m
=
Number of logic modules switching at frequency fm
n
=
Number of input buffers switching at frequency fn
p
=
Number of output buffers switching at frequency fp
q1
=
Number of clock loads on the first routed array clock
q2
=
Number of clock loads on the second routed array clock
r1
=
Fixed capacitance due to first routed array clock
r2
=
Fixed capacitance due to second routed array clock
CEQM = Equivalent capacitance of logic modules in pF
CEQI = Equivalent capacitance of input buffers in pF
CEQO = Equivalent capacitance of output buffers in pF
CEQC
R
=
Equivalent capacitance of routed array clock in pF
CL
=
Output load capacitance in pF
fm
=
Average logic module switching rate in MHz
fn
=
Average input buffer switching rate in MHz
fp
=
Average output buffer switching rate in MHz
fq1
=
Average first routed array clock rate in MHz
fq2
=
Average second routed array clock rate in MHz
Device Type
r1
routed_Clk1
r2
routed_Clk2
A40MX02
41.4
N/A
A40MX04
68.6
N/A
A42MX09
118
A42MX16
165
A42MX24
185
A42MX36
220
相关PDF资料
PDF描述
M1A3P600-FGG144 IC FPGA 1KB FLASH 600K 144-FBGA
A3P600-FG144 IC FPGA 1KB FLASH 600K 144-FBGA
M1A3P600-FG144 IC FPGA 1KB FLASH 600K 144-FBGA
EX256-TQ100A IC FPGA ANTIFUSE 12K 100-TQFP
EX256-TQG100A IC FPGA ANTIFUSE 12K 100-TQFP
相关代理商/技术参数
参数描述
A40MX02-PLG44M 制造商:Microsemi Corporation 功能描述:FPGA 40MX Family 3K Gates 295 Cells 83MHz/139MHz 0.45um Technology 3.3V/5V 44-Pin PLCC 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC
A40MX02-PLG68 功能描述:IC FPGA 57I/O 68PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
A40MX02-PLG68A 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A40MX02-PLG68I 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-PLG68M 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 68PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA 57 I/O 68PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC