参数资料
| 型号： | A40MX02-PQ100A |
| 厂商： | Microsemi SoC |
| 文件页数： | 35/142页 |
| 文件大小： | 0K |
| 描述： | IC FPGA MX SGL CHIP 3K 100-PQFP |
| 标准包装： | 66 |
| 系列： | MX |
| 输入/输出数： | 57 |
| 门数： | 3000 |
| 电源电压： | 3 V ~ 3.6 V，4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 100-BQFP |
| 供应商设备封装： | 100-PQFP（14x20） |
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40MX and 42MX FPGA Families
Re vi s i on 11
1-9
Power Supply
MX devices are designed to operate in both 5.0V and 3.3V environments. In particular, 42MX devices
can operate in mixed 5.0V/3.3V systems. Table 1-1 describes the voltage support of MX devices.
Power-Up/Down in Mixed-Voltage Mode
When powering up 42MX in mixed voltage mode (VCCA = 5.0 V and VCCI = 3.3 V), VCCA must be
greater than or equal to VCCI throughout the power-up sequence. If VCCI exceeds VCCA during power-
up, one of two things will happen:
The input protection diode on the I/Os will be forward biased
The I/Os will be at logical High
In either case, ICC rises to high levels.
For power-down, any sequence with VCCA and VCCI can be implemented.
Transient Current
Due to the simultaneous random logic switching activity during power-up, a transient current may appear
on the core supply (VCC). Customers must use a regulator for the VCC supply that can source a
minimum of 100 mA for transient current during power-up. Failure to provide enough power can prevent
the system from powering up properly and result in functional failure. However, there are no reliability
concerns, since transient current is distributed across the die instead of confined to a localized spot.
Since the transient current is not due to I/O switching, its value and duration are independent of the
VCCI.
Low Power Mode
42MX devices have been designed with a Low Power Mode. This feature, activated with setting the
special LP pin to HIGH for a period longer than 800 ns, is particularly useful for battery-operated systems
where battery life is a primary concern. In this mode, the core of the device is turned off and the device
consumes minimal power with low standby current. In addition, all input buffers are turned off, and all
outputs and bidirectional buffers are tristated. Since the core of the device is turned off, the states of the
registers are lost. The device must be re-initialized when exiting Low Power Mode. I/Os can be driven
during LP mode, and clock pins should be driven HIGH or LOW and should not float to avoid drawing
current. To exit LP mode, the LP pin must be pulled LOW for over 200 s to allow for charge pumps to
power up, and device initialization will begin.
Table 1-1
Voltage Support of MX Devices
Device
VCC
VCCA
VCCI
Maximum Input Tolerance
Nominal Output Voltage
40MX
5.0 V
–
5.5 V
5.0V
3.3 V
–
3.6 V
3.3V
42MX
–
5.0 V
5.5 V
5.0V
–
3.3 V
3.6 V
3.3V
–
5.0 V
3.3 V
5.5 V
3.3V
相关PDF资料 |
PDF描述 |
|---|---|
| A40MX02-PQG100A | IC FPGA MX SGL CHIP 3K 100-PQFP |
| A40MX02-2PLG68 | IC FPGA MX SGL CHIP 3K 68-PLCC |
| RMA49DRSI-S288 | CONN EDGECARD 98POS .125 EXTEND |
| RSM44DRYN | CONN EDGECARD 88POS DIP .156 SLD |
| RMM44DRYN | CONN EDGECARD 88POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A40MX02-PQ100ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX FPGA Families |
| A40MX02-PQ100I | 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A40MX02-PQ100M | 制造商:Microsemi Corporation 功能描述:FPGA 40MX Family 3K Gates 295 Cells 83MHz/139MHz 0.45um Technology 3.3V/5V 100-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 100PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP |
| A40MX02-PQ208A | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families |
| A40MX02-PQG100 | 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
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