参数资料
型号: A40MX04-1VQ80M
元件分类: FPGA
英文描述: FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP80
封装: 1 MM HEIGHT, PLASTIC, VQFP-80
文件页数: 37/124页
文件大小: 3142K
代理商: A40MX04-1VQ80M
40MX and 42MX FPGA Families
ii
v6.1
Ordering Information
Plastic Device Resources
_
Part Number
Speed Grade
Package Type
Package Lead Count
Blank = Commercial (0 to +70C)
I
=
Industrial (–40 to +85C)
M
=
Military (–55 to +125C)
B
=
MIL-STD-883
A
=
Automotive (–40 to +125C)
Application (Temperature Range)
PL
=
Plastic Leaded Chip Carrier
PQ =
Plastic Quad Flat Pack
TQ =
Thin (1.4 mm) Quad Flat Pack
VQ =
Very Thin (1.0 mm) Quad Flat Pack
BG =
Plastic Ball Grid Array
CQ =
Ceramic Quad Flat Pack
Blank = Standard Speed
–1
=
Approximately 15% Faster than Standard
–2
=
Approximately 25% Faster than Standard
–3
=
Approximately 35% Faster than Standard
–F
=
Approximately 40% Slower than Standard
A40MX02
=
3,000 System Gates
A40MX04
=
6,000 System Gates
A42MX09
=
14,000 System Gates
A42MX16
=
24,000 System Gates
A42MX24
=
36,000 System Gates
A42MX36
=
54,000 System Gates
A42MX16
1
PQ
100
ES
User I/Os
Device
PLCC
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PQFP
100-Pin
PQFP
160-Pin
PQFP
208-Pin
PQFP
240-Pin
VQFP
80-Pin
VQFP
100-Pin
TQFP
176-Pin
PBGA
272-Pin
A40MX02
34
57
57
57
A40MX04
34
57
69
69
A42MX09
72
83
101
83
104
A42MX16
72
83
125
140
83
140
A42MX24
72
125
176
150
A42MX36
–––––
176
202
––
202
Note: Package Definitions
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,
PBGA = Plastic Ball Grid Array
相关PDF资料
PDF描述
A40MX04-1VQ80X79 FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP80
A40MX04-1VQ80 FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP80
A40MX04-2PL44IX79 FPGA, 547 CLBS, 6000 GATES, 101 MHz, PQCC44
A40MX04-2PL44I FPGA, 547 CLBS, 6000 GATES, 101 MHz, PQCC44
A40MX04-2PL44X79 FPGA, 547 CLBS, 6000 GATES, 101 MHz, PQCC44
相关代理商/技术参数
参数描述
A40MX04-1VQG80 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-1VQG80I 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-1VQG80M 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 80VQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 80VQFP
A40MX04-2PL44 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-2PL44I 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)