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参数资料
| 型号： | A40MX04-3PL68I |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC68 |
| 封装： | PLASTIC, LCC-68 |
| 文件页数： | 27/124页 |
| 文件大小： | 3142K |
| 代理商： | A40MX04-3PL68I |
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FPGA Families 40MX and 42MX
3- 2
v6.1
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully
characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet
Supplement." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) containing general product
information. This brief gives an overview of specific device and family information.
Advanced
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
Datasheet Supplement
The datasheet supplement gives specific device information for a derivative family that differs from the general family
datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and
for specifications that do not differ between the two families.
5.1
(continued)
In the 100-Pin PQFP table, the following pins changed:
Pin 64 (42MX09 and 42MX16) has changed to LP
In the 160-Pin PQFP table, the following pins changed:
Pin 61 (42MX09, 42MX16, and 42MX64) has changed to LP
In the 208-Pin PQFP table, the following pins changed:
Pin 129 (42MX09, 42MX16, and 42MX64) has changed to LP
Pin 198 (42MX09) has changed to I/O
The n the 240-Pin PQFP table, the following pins changed:
Pin 91 (42MX36) has changed to LP
In the 100-Pin VQFP Package table, the following pins changed:
Pin 62 (42MX09 and 42MX16) has changed to LP
In the 176-Pin TQFP table, the following pins changed:
Pin 109 (42MX09 and 42MX16) has changed to LP
In the 272-Pin PBGA table, the following pins changed:
Pin K20 (42MX36) has changed to LP
v5.0
The "Low Power Mode" section was updated.
Footnote 8 in the Table 9 5V TTL Electrical Specifications was updated.
Footnote 8 in the Table 13 3.3V LVTTL Electrical Specifications was updated.
v4.0.1
Because the changes in this data sheet are extensive and technical in nature, this should be viewed
as a new document. Please read it as you would a data sheet that is published for the first time.
ALL
Note that the “Package Characteristics and Mechanical Drawings” section has been eliminated
from the data sheet. The mechanical drawings are now contained in a separate document,
“Package Characteristics and Mechanical Drawings,” available on the Actel web site.
Previous version
Changes in current version (v 6. 1 )
Page
相关PDF资料 |
PDF描述 |
|---|---|
| A40MX04-3PL68X79 | FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC68 |
| A40MX04-3PL68 | FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC68 |
| A40MX04-3PL84IX79 | FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC84 |
| A40MX04-3PL84I | FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC84 |
| A40MX04-3PL84X79 | FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC84 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A40MX04-3PL68M | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA) |
| A40MX04-3PL84 | 功能描述:IC FPGA MX SGL CHIP 6K 84-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A40MX04-3PL84I | 功能描述:IC FPGA MX SGL CHIP 6K 84-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A40MX04-3PL84M | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA) |
| A40MX04-3PLG44 | 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
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