参数资料
型号: A40MX04-PQ100M
元件分类: FPGA
英文描述: FPGA, 547 CLBS, 6000 GATES, 80 MHz, PQFP100
封装: PLASTIC, QFP-100
文件页数: 105/124页
文件大小: 3142K
代理商: A40MX04-PQ100M
40MX and 42MX FPGA Families
v6.1
1-75
Input Module Predicted Routing Delays2
tIRD1
FO=1 Routing Delay
2.8
3.1
3.5
4.1
5.7
ns
tIRD2
FO=2 Routing Delay
3.2
3.5
4.1
4.8
6.7
ns
tIRD3
FO=3 Routing Delay
3.7
4.1
4.7
5.5
7.7
ns
tIRD4
FO=4 Routing Delay
4.2
4.6
5.3
6.2
8.7
ns
tIRD8
FO=8 Routing Delay
6.1
6.8
7.7
9.0
12.6
ns
Global Clock Network
tCKH
Input LOW to HIGH
FO=32
FO=635
4.6
5.0
5.1
5.6
5.7
6.3
6.7
7.4
9.3
10.3
ns
tCKL
Input HIGH to LOW
FO=32
FO=635
5.3
6.8
5.9
7.6
6.7
8.6
7.8
10.1
11.0
14.1
ns
tPWH
Minimum Pulse
Width HIGH
FO=32
FO=635
2.5
2.8
2.7
3.1
3.5
3.6
4.1
5.1
5.7
ns
tPWL
Minimum Pulse
Width LOW
FO=32
FO=635
2.5
2.8
2.7
3.1
3.5
3.6
4.1
5.1
5.7
ns
tCKSW
Maximum Skew
FO=32
FO=635
1.0
1.2
1.3
1.5
2.2
ns
tSUEXT
Input Latch
External Set-Up
FO=32
FO=635
0.0
ns
tHEXT
Input Latch
External Hold
FO=32
FO=635
4.0
4.6
4.4
5.2
5.0
5.9
6.9
8.2
9.6
ns
tP
Minimum Period
(1/fMAX)
FO=32
FO=635
9.2
9.9
10.2
11.0
11.1
12.0
12.7
13.8
21.2
23.0
ns
fMAX
Maximum Datapath
Frequency
FO=32
FO=635
108
100
98
91
90
83
79
73
47
44
MHz
TTL Output Module Timing5
tDLH
Data-to-Pad HIGH
3.6
4.0
4.5
5.3
7.4
ns
tDHL
Data-to-Pad LOW
4.2
4.6
5.2
6.2
8.6
ns
tENZH
Enable Pad Z to HIGH
3.7
4.2
4.7
5.5
7.7
ns
tENZL
Enable Pad Z to LOW
4.1
4.6
5.2
6.1
8.5
ns
tENHZ
Enable Pad HIGH to Z
7.34
8.2
9.3
10.9
15.3
ns
Table 39
A42MX36 Timing Characteristics (Nominal 3.3V Operation) (Continued)
(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)
‘–3’ Speed
‘–2’ Speed
‘–1’ Speed
‘Std’ Speed
‘–F’ Speed
Parameter Description
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be
obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/
hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to
the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相关PDF资料
PDF描述
A40MX04-PQ100X79 FPGA, 547 CLBS, 6000 GATES, 80 MHz, PQFP100
A40MX04-PQ100 FPGA, 547 CLBS, 6000 GATES, 80 MHz, PQFP100
A40MX04-VQ80AX79 FPGA, 547 CLBS, 6000 GATES, 116 MHz, PQFP80
A40MX04-VQ80A FPGA, 547 CLBS, 6000 GATES, 116 MHz, PQFP80
A40MX04-VQ80IX79 FPGA, 547 CLBS, 6000 GATES, 80 MHz, PQFP80
相关代理商/技术参数
参数描述
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A40MX04PQG100 制造商:Microsemi SOC Products Group 功能描述:
A40MX04-PQG100 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-PQG100A 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-PQG100I 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)