参数资料
| 型号： | A42MX09-3PLG84I |
| 厂商： | Microsemi SoC |
| 文件页数： | 46/142页 |
| 文件大小： | 0K |
| 描述： | IC FPGA MX SGL CHIP 14K 84-PLCC |
| 标准包装： | 16 |
| 系列： | MX |
| 输入/输出数： | 72 |
| 门数： | 14000 |
| 电源电压： | 3 V ~ 3.6 V，4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 84-LCC（J 形引线） |
| 供应商设备封装： | 84-PLCC（29.31x29.31） |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页当前第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页
40MX and 42MX FPGA Families
1- 10
R e v i sio n 1 1
Power Dissipation
The general power consumption of MX devices is made up of static and dynamic power and can be
expressed with the following equation:
General Power Equation
P = [ICCstandby + ICCactive] * VCCI + IOL* VOL* N + IOH * (VCCI – VOH) * M
where:
ICCstandby is the current flowing when no inputs or outputs are changing.
ICCactive is the current flowing due to CMOS switching.
IOL, IOH are TTL sink/source currents.
VOL, VOH are TTL level output voltages.
N equals the number of outputs driving TTL loads to VOL.
M equals the number of outputs driving TTL loads to VOH.
Accurate values for N and M are difficult to determine because they depend on the family type, on design
details, and on the system I/O. The power can be divided into two components: static and active.
Static Power Component
The static power due to standby current is typically a small component of the overall power consumption.
Standby power is calculated for commercial, worst-case conditions. The static power dissipation by TTL
loads depends on the number of outputs driving, and on the DC load current. For instance, a 32-bit bus
sinking 4mA at 0.33V will generate 42mW with all outputs driving LOW, and 140mW with all outputs
driving HIGH. The actual dissipation will average somewhere in between, as I/Os switch states with time.
Active Power Component
Power dissipation in CMOS devices is usually dominated by the dynamic power dissipation. Dynamic
power consumption is frequency-dependent and is a function of the logic and the external I/O. Active
power dissipation results from charging internal chip capacitances of the interconnect, unprogrammed
antifuses, module inputs, and module outputs, plus external capacitances due to PC board traces and
load device inputs. An additional component of the active power dissipation is the totem pole current in
the CMOS transistor pairs. The net effect can be associated with an equivalent capacitance that can be
combined with frequency and voltage to represent active power dissipation.
The power dissipated by a CMOS circuit can be expressed by the equation:
Power (W) = CEQ * VCCA2 * F(1)
where:
CEQ = Equivalent capacitance expressed in picofarads (pF)
VCCA = Power supply in volts (V)
F = Switching frequency in megahertz (MHz)
Equivalent Capacitance
Equivalent capacitance is calculated by measuring ICCactive at a specified frequency and voltage for
each circuit component of interest. Measurements have been made over a range of frequencies at a
fixed value of VCC. Equivalent capacitance is frequency-independent, so the results can be used over a
wide range of operating conditions. Equivalent capacitance values are shown below.
相关PDF资料 |
PDF描述 |
|---|---|
| 977-009-020R121 | BACKSHELL DB9 METALIZED PLASTIC |
| A54SX08-1PLG84I | IC FPGA SX 12K GATES 84-PLCC |
| 977-025-010R031 | BACKSHELL DB25 GREY PLASTIC |
| 10320-52F0-008 | CONN JUNCTION SHELL 20POS STRGT |
| FMM18DSEN-S13 | CONN EDGECARD 36POS .156 EXTEND |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A42MX09-3PQ100 | 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX09-3PQ100A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:40MX and 42MX FPGA Families |
| A42MX09-3PQ100B | 制造商:未知厂家 制造商全称:未知厂家 功能描述:40MX and 42MX FPGA Families |
| A42MX09-3PQ100ES | 制造商:未知厂家 制造商全称:未知厂家 功能描述:40MX and 42MX FPGA Families |
| A42MX09-3PQ100I | 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
发布紧急采购，3分钟左右您将得到回复。