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参数资料
型号： A42MX16-1PQ160I
厂商： Microsemi SoC
文件页数： 110/142页
文件大小： 0K
描述： IC FPGA MX SGL CHIP 24K 160-PQFP
标准包装： 24
系列： MX
输入/输出数： 125
门数： 24000
电源电压： 3 V ~ 3.6 V，4.5 V ~ 5.5 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 160-BQFP
供应商设备封装： 160-PQFP（28x28）
40MX and 42MX FPGA Families
Re vi s i on 11
1-3
A42MX24 and A42MX36 devices contain D-modules, which are arranged around the periphery of the
device. D-modules contain wide-decode circuitry, providing a fast, wide-input AND function similar to that
found in CPLD architectures (Figure 1-4). The D-module allows A42MX24 and A42MX36 devices to
perform wide-decode functions at speeds comparable to CPLDs and PALs. The output of the D-module
has a programmable inverter for active HIGH or LOW assertion. The D-module output is hardwired to an
output pin, and can also be fed back into the array to be incorporated into other logic.
Dual-Port SRAM Modules
The A42MX36 device contains dual-port SRAM modules that have been optimized for synchronous or
asynchronous applications. The SRAM modules are arranged in 256-bit blocks that can be configured as
32x8 or 64x4. SRAM modules can be cascaded together to form memory spaces of user-definable width
and depth. A block diagram of the A42MX36 dual-port SRAM block is shown in Figure 1-5.
The A42MX36 SRAM modules are true dual-port structures containing independent read and write ports.
Each SRAM module contains six bits of read and write addressing (RDAD[5:0] and WRAD[5:0],
respectively) for 64x4-bit blocks. When configured in byte mode, the highest order address bits (RDAD5
and WRAD5) are not used. The read and write ports of the SRAM block contain independent clocks
(RCLK and WCLK) with programmable polarities offering active HIGH or LOW implementation. The
SRAM block contains eight data inputs (WD[7:0]), and eight outputs (RD[7:0]), which are connected to
segmented vertical routing tracks.
The A42MX36 dual-port SRAM blocks provide an optimal solution for high-speed buffered applications
requiring FIFO and LIFO queues. The ACTgen Macro Builder within Microsemi's Designer software
Figure 1-3
42MX S-Module Implementation
CLR
Up to 7-Input Function Plus D-Type Flip-Flop with Clear
Up to 4-Input Function Plus Latch with Clear
D0
D1
S
Y
D
Q
GATE
CLR
OUT
Up to 8-Input Function (Same as C-Module)
D00
D01
D10
D11
S1
S0
Y
OUT
Up to 7-Input Function Plus Latch
D00
D01
D10
D11
S1
S0
Y
OUT
GATE
D
Q
D00
D01
D10
D11
S1
S0
Y
D
Q
OUT
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相关代理商/技术参数
参数描述
A42MX16-1PQ160M 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 119MHZ/198MHZ 0.45UM 3.3V/5V 160PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 125 I/O 160PQFP
A42MX16-1PQ208 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
A42MX16-1PQ208I 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
A42MX16-1PQ208M 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 119MHZ/198MHZ 0.45UM 3.3V/5V 208PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 208PQFP
A42MX16-1PQG100 功能描述:IC FPGA MX SGL CHIP 24K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
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