参数资料
型号: A42MX16-PQ208
厂商: Microsemi SoC
文件页数: 59/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 24K 208-PQFP
标准包装: 24
系列: MX
输入/输出数: 140
门数: 24000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 19
3.3 V Operating Conditions
Table 1-10 Absolute Maximum Ratings for 40MX Devices*
Symbol
Parameter
Limits
Units
VCC
DC Supply Voltage
–0.5 to +7.0
V
VI
Input Voltage
–0.5 to VCC + 0.5
V
VO
Output Voltage
–0.5 to VCC + 0.5
V
tSTG
Storage Temperature
–65 to + 150
°C
Note:
*Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Devices
should not be operated outside the Recommended Operating Conditions.
Table 1-11 Absolute Maximum Ratings for 42MX Devices*
Symbol
Parameter
Limits
Units
VCCI
DC Supply Voltage for I/Os
–0.5 to +7.0
V
VCCA
DC Supply Voltage for Array
–0.5 to +7.0
V
VI
Input Voltage
–0.5 to VCCI+0.5
V
VO
Output Voltage
–0.5 to VCCI+0.5
V
tSTG
Storage Temperature
–65 to +150
°C
Note:
*Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Devices
should not be operated outside the Recommended Operating Conditions.
Table 1-12 Recommended Operating Conditions
Parameter
Commercial
Industrial
Military
Units
Temperature Range*
0 to +70
–40 to +85
–55 to +125
°C
VCC (40MX)
3.0 to 3.6
V
VCCA (42MX)
3.0 to 3.6
V
VCCI (42MX)
3.0 to 3.6
V
Note:
*Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for
military grades.
相关PDF资料
PDF描述
A42MX09-3PQ100 IC FPGA MX SGL CHIP 14K 100-PQFP
EMC55DRSN-S273 CONN EDGECARD 110PS DIP .100 SLD
A42MX09-3PQG100 IC FPGA MX SGL CHIP 14K 100-PQFP
EPF10K30EQC208-2X IC FLEX 10KE FPGA 30K 208-PQFP
EMC55DRSD-S273 CONN EDGECARD 110PS DIP .100 SLD
相关代理商/技术参数
参数描述
A42MX16-PQ208A 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX16-PQ208I 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX16-PQ208M 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM 3.3V/5V 208PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 208PQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP
A42MX16-PQG100 功能描述:IC FPGA 140I/O 100PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
A42MX16-PQG100A 功能描述:IC FPGA MX SGL CHIP 24K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)