收藏本站
参数资料
型号： A42MX16-TQ176
厂商： Microsemi SoC
文件页数： 45/142页
文件大小： 0K
描述： IC FPGA MX SGL CHIP 24K 176-TQFP
标准包装： 40
系列： MX
输入/输出数： 140
门数： 24000
电源电压： 3 V ~ 3.6 V，4.75 V ~ 5.25 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 176-LQFP
供应商设备封装： 176-TQFP（24x24）
Re vi s i on 11
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 11
(May 2012)
The FuseLock logo and accompanying text was removed from the "User Security"
section. This marking is no longer used on Microsemi devices (PCN 0915).
1-8
The "Development Tool Support" section was updated (SAR 38512).
1-16
Revision 10
(April 2012)
"Ordering Information" was updated to include lead-free package ordering codes
(SAR 21968).
ii
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement the best
security available in the industry (SAR 34673).
1-8
The "Transient Current" section is new (SAR 36930).
1-9
Package names were revised according to standards established in Package
Mechanical Drawings (SAR 34774).
2-1
Revision 9
(v6.1, April 2009)
In Table 1-14 Absolute Maximum Ratings*, the limits in VI were changed from -0.5 to
VCCI + 0.5 to -0.5 to VCCA + 0.5.
1-21
In Table 1-16 Mixed 5.0V/3.3V Electrical Specifications, VOH was changed from 3.7
to 2.4 for the min in industrial and military. VIH had VCCI and that was changed to
VCCA.
1-22
v6.0
(January 2004)
The "Ease of Integration" section was updated.
1-i
The "Temperature Grade Offerings" section is new.
1-iii
The "Speed Grade Offerings" section is new.
1-iii
The "General Description" section was updated.
1-1
The "MultiPlex I/O Modules" section was updated.
1-7
The "User Security" section was updated.
1-8
Table 1-1 Voltage Support of MX Devices was updated.
1-9
The "Power Dissipation" section was updated.
1-10
The "Static Power Component" section was updated.
1-10
The "Equivalent Capacitance" section was updated.
1-10
Figure 1-12 Silicon Explorer II Setup with 42MX was updated.
1-12
Table 1-4 Supported BST Public Instructions was updated.
1-14
Figure 1-13 42MX IEEE 1149.1 Boundary Scan Circuitry was updated.
1-14
Table 1-5 Boundary Scan Pin Configuration and Functionality was updated.
1-15
The "Development Tool Support" section was updated.
1-16
相关PDF资料
PDF描述
A54SX32A-TQ100I IC FPGA SX 48K GATES 100-TQFP
A54SX32A-1TQ100 IC FPGA SX 48K GATES 100-TQFP
A54SX32A-1TQG100 IC FPGA SX 48K GATES 100-TQFP
A54SX32A-TQG100I IC FPGA SX 48K GATES 100-TQFP
EPF6024ABC256-1 IC FLEX 6000 FPGA 24K 256-BGA
相关代理商/技术参数
参数描述
A42MX16-TQ176A 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
A42MX16-TQ176I 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
A42MX16-TQ176M 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM 3.3V/5V 176TQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 176TQFP
A42MX16-TQ208A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX16-TQG176 功能描述:IC FPGA 140I/O 176TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA（23x23） 其它名称:220-1241
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*