参数资料
型号: A42MX24-2PQ160I
厂商: Microsemi SoC
文件页数: 48/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 36K 160-PQFP
标准包装: 24
系列: MX
输入/输出数: 125
门数: 36000
电源电压: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 160-BQFP
供应商设备封装: 160-PQFP(28x28)
40MX and 42MX FPGA Families
Re vi s i on 11
3-3
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has
been fully characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and
"Datasheet Supplement." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) containing general
product information. This brief gives an overview of specific device and family information.
Advance
This datasheet version contains initial estimated information based on simulation, other products,
devices, or speed grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
Datasheet Supplement
The datasheet supplement gives specific device information for a derivative family that differs from the
general family datasheet. The supplement is to be used in conjunction with the datasheet to obtain more
detailed information and for specifications that do not differ between the two families.
相关PDF资料
PDF描述
AMM22DTBS-S189 CONN EDGECARD 44POS R/A .156 SLD
M1AGL1000V2-FGG144I IC FPGA 1KB FLASH 1M 144-FBGA
AMM22DTAS-S189 CONN EDGECARD 44POS R/A .156 SLD
M1AGL1000V2-FG144I IC FPGA 1KB FLASH 1M 144-FBGA
AT24C256C-MAHL-T IC EEPROM 256KBIT IND 8UDFN
相关代理商/技术参数
参数描述
A42MX24-2PQ208 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-2PQ208I 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-2PQG160 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-2PQG160I 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-2PQG208 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)