参数资料
型号: A42MX24-TQ176
厂商: Microsemi SoC
文件页数: 121/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 36K 176-TQFP
标准包装: 40
系列: MX
输入/输出数: 150
门数: 36000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 176-LQFP
供应商设备封装: 176-TQFP(24x24)
40MX and 42MX FPGA Families
1- 4
R ev isio n 1 1
provides capability to quickly design memory functions with the SRAM blocks. Unused SRAM blocks can
be used to implement registers for other user logic within the design.
Routing Structure
The MX architecture uses vertical and horizontal routing tracks to interconnect the various logic and I/O
modules. These routing tracks are metal interconnects that may be continuous or split into segments.
Varying segment lengths allow the interconnect of over 90% of design tracks to occur with only two
antifuse connections. Segments can be joined together at the ends using antifuses to increase their
lengths up to the full length of the track. All interconnects can be accomplished with a maximum of four
antifuses.
Horizontal Routing
Horizontal routing tracks span the whole row length or are divided into multiple segments and are located
in between the rows of modules. Any segment that spans more than one-third of the row length is
considered a long horizontal segment. A typical channel is shown in Figure 1-6. Within horizontal routing,
dedicated routing tracks are used for global clock networks and for power and ground tie-off tracks. Non-
dedicated tracks are used for signal nets.
Vertical Routing
Another set of routing tracks run vertically through the module. There are three types of vertical tracks:
input, output, and long. Long tracks span the column length of the module, and can be divided into
multiple segments. Each segment in an input track is dedicated to the input of a particular module; each
segment in an output track is dedicated to the output of a particular module. Long segments are
Figure 1-4
A42MX24 and A42MX36 D-Module Implementation
Figure 1-5
A42MX36 Dual-Port SRAM Block
7 Inputs
Hard-Wire to I/O
Feedback to Array
Programmable
Inverter
SRAM Module
32 x 8 or 64 x 4
(256 Bits)
Read
Port
Logic
Write
Port
Logic
RD[7:0]
Routing Tracks
Latches
Read
Logic
[5:0]
RDAD[5:0]
REN
RCLK
Latches
WD[7:0]
Latches
WRAD[5:0]
Write
Logic
MODE
BLKEN
WEN
WCLK
[5:0]
[7:0]
相关PDF资料
PDF描述
A3P1000L-1FGG484I IC FPGA 1KB FLASH 1M 484-FBGA
A3P1000L-1FG484I IC FPGA 1KB FLASH 1M 484-FBGA
M1A3P1000L-1FG484I IC FPGA M1 1KB FLASH 1M 484FBGA
A1020B-2PLG44I IC FPGA 2K GATES 44-PLCC IND
A1020B-2PL44I IC FPGA 2K GATES 44-PLCC IND
相关代理商/技术参数
参数描述
A42MX24-TQ176A 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-TQ176I 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-TQ176M 制造商:Microsemi Corporation 功能描述:FPGA 36K GATES 912 CELLS 0.45UM 3.3V/5V 176TQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 150 I/O 176TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP
A42MX24-TQG176 功能描述:IC FPGA 176I/O 176TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
A42MX24-TQG176A 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)