参数资料
型号: A42MX36-2TQ100B
厂商: Electronic Theatre Controls, Inc.
英文描述: 40MX and 42MX FPGA Families
中文描述: 40MX和42MX FPGA系列
文件页数: 9/64页
文件大小: 854K
代理商: A42MX36-2TQ100B
40MX and 42MX FPGA Families
v6.0
1-11
Each I/O cell has three boundary-scan register cells, each
with a serial-in, serial-out, parallel-in, and parallel-out
pin. The serial pins are used to serially connect all the
boundary-scan register cells in a device into a boundary-
scan register chain, which starts at the TDI pin and ends
at the TDO pin. The parallel ports are connected to the
internal core logic tile and the input, output and control
ports of an I/O buffer to capture and load data into the
register to control or observe the logic state of each I/O.
Figure 1-14 42MX IEEE 1149.1 Boundary Scan Circuitry
Table 3
Test Access Port Descriptions
Port
Description
TMS
(Test
Mode
Select)
Serial input for the test logic control bits. Data is captured on the rising edge of the test logic clock (TCK).
TCK (Test Clock Input) Dedicated test logic clock used serially to shift test instruction, test data, and control inputs on the rising edge
of the clock, and serially to shift the output data on the falling edge of the clock. The maximum clock frequency
for TCK is 20 MHz.
TDI (Test Data Input)
Serial input for instruction and test data. Data is captured on the rising edge of the test logic clock.
TDO
(Test
Data
Output)
Serial output for test instruction and data from the test logic. TDO is set to an Inactive Drive state (high
impedance) when data scanning is not in progress.
Table 4
Supported BST Public Instructions
Instruction
IR Code (IR2.IR0)
Instruction Type
Description
EXTEST
000
Mandatory
Allows the external circuitry and board-level interconnections to
be tested by forcing a test pattern at the output pins and
capturing test results at the input pins.
SAMPLE/PRELOAD
001
Mandatory
Allows a snapshot of the signals at the device pins to be
captured and examined during operation
HIGH Z
101
Optional
Tristates all I/Os to allow external signals to drive pins. Please
refer to the IEEE Standard 1149.1 specification.
CLAMP
110
Optional
Allows state of signals driven from component pins to be
determined from the Boundary-Scan Register. Please refer to
the IEEE Standard 1149.1 specification for details.
BYPASS
111
Mandatory
Enables the bypass register between the TDI and TDO pins. The
test data passes through the selected device to adjacent devices
in the test chain.
Boundary Scan Register
Instruction
Decode
Control Logic
TAP Controller
Instruction
Register
Bypass
Register
TMS
TCK
TDI
Output
MUX
TDO
JTAG
相关PDF资料
PDF描述
A42MX36-2VQ100 40MX and 42MX FPGA Families
A42MX36-2VQ100A 40MX and 42MX FPGA Families
A42MX36-2VQ100B 40MX and 42MX FPGA Families
A42MX36-3PQ100B 40MX and 42MX FPGA Families
A42MX36-3BG100 40MX and 42MX FPGA Families
相关代理商/技术参数
参数描述
A42MX36-3BG272 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3BG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3BGG272 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3BGG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3PQ208 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)