参数资料
型号: A42MX36-3PQ240I
厂商: Microsemi SoC
文件页数: 35/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 54K 240-PQFP
标准包装: 24
系列: MX
RAM 位总计: 2560
输入/输出数: 202
门数: 54000
电源电压: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 240-BFQFP
供应商设备封装: 240-PQFP(32x32)
40MX and 42MX FPGA Families
Re vi s i on 11
1-9
Power Supply
MX devices are designed to operate in both 5.0V and 3.3V environments. In particular, 42MX devices
can operate in mixed 5.0V/3.3V systems. Table 1-1 describes the voltage support of MX devices.
Power-Up/Down in Mixed-Voltage Mode
When powering up 42MX in mixed voltage mode (VCCA = 5.0 V and VCCI = 3.3 V), VCCA must be
greater than or equal to VCCI throughout the power-up sequence. If VCCI exceeds VCCA during power-
up, one of two things will happen:
The input protection diode on the I/Os will be forward biased
The I/Os will be at logical High
In either case, ICC rises to high levels.
For power-down, any sequence with VCCA and VCCI can be implemented.
Transient Current
Due to the simultaneous random logic switching activity during power-up, a transient current may appear
on the core supply (VCC). Customers must use a regulator for the VCC supply that can source a
minimum of 100 mA for transient current during power-up. Failure to provide enough power can prevent
the system from powering up properly and result in functional failure. However, there are no reliability
concerns, since transient current is distributed across the die instead of confined to a localized spot.
Since the transient current is not due to I/O switching, its value and duration are independent of the
VCCI.
Low Power Mode
42MX devices have been designed with a Low Power Mode. This feature, activated with setting the
special LP pin to HIGH for a period longer than 800 ns, is particularly useful for battery-operated systems
where battery life is a primary concern. In this mode, the core of the device is turned off and the device
consumes minimal power with low standby current. In addition, all input buffers are turned off, and all
outputs and bidirectional buffers are tristated. Since the core of the device is turned off, the states of the
registers are lost. The device must be re-initialized when exiting Low Power Mode. I/Os can be driven
during LP mode, and clock pins should be driven HIGH or LOW and should not float to avoid drawing
current. To exit LP mode, the LP pin must be pulled LOW for over 200 s to allow for charge pumps to
power up, and device initialization will begin.
Table 1-1
Voltage Support of MX Devices
Device
VCC
VCCA
VCCI
Maximum Input Tolerance
Nominal Output Voltage
40MX
5.0 V
5.5 V
5.0V
3.3 V
3.6 V
3.3V
42MX
5.0 V
5.5 V
5.0V
3.3 V
3.6 V
3.3V
5.0 V
3.3 V
5.5 V
3.3V
相关PDF资料
PDF描述
GBB108DHAR CONN EDGECARD 216PS R/A .050 SLD
A42MX36-3PQG240I IC FPGA MX SGL CHIP 54K 240-PQFP
EP1S10F780I6 IC STRATIX FPGA 10K LE 780-FBGA
AMM24DTMN CONN EDGECARD 48POS R/A .156 SLD
EP1S10F780C5 IC STRATIX FPGA 10K LE 780-FBGA
相关代理商/技术参数
参数描述
A42MX36-3PQG208 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3PQG208I 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3PQG240 功能描述:IC FPGA MX SGL CHIP 54K 240-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-3PQG240I 功能描述:IC FPGA MX SGL CHIP 54K 240-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-BG272 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)