参数资料
型号: A4987SLPTR-T
厂商: Allegro Microsystems Inc
文件页数: 1/17页
文件大小: 0K
描述: IC STEPPER MOTOR DRIVER 24TSSOP
特色产品: A498x Motor Driver Family
标准包装: 1
应用: PWM 电机驱动器,步进电机驱动器
评估套件: 可供
输出数: 1
电流 - 输出: ± 1A
电压 - 负载: 8 V ~ 35 V
电源电压: 3 V ~ 5.5 V
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm)裸露焊盘
供应商设备封装: 24-TSSOP 裸露焊盘
包装: 标准包装
其它名称: 620-1345-6
A4987
DMOS Dual Full-Bridge PWM Motor Driver
With Overcurrent Protection
Features and Benefits
Description
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Low R DS(ON) outputs
Internal mixed current decay mode
Synchronous rectification for low power dissipation
Internal UVLO
Crossover-current protection
3.3 and 5 V compatible logic supply
Thin profile QFN and TSSOP packages
Thermal shutdown circuitry
Short-to-ground protection
Shorted load protection
Low current Sleep mode, < 10 μ A
The A4987 is a dual DMOS full-bridge stepper motor driver
with parallel input communication and overcurrent protection.
Each full-bridge output is rated up to 35 V and ±1 A. The A4987
includes fixed off-time pulse width modulation (PWM) current
regulators, along with 2- bit nonlinear DACs (digital-to-analog
converters) that allow stepper motors to be controlled in full,
half, and quarter steps. The PWM current regulator uses the
Allegro ? patented mixed decay mode for reduced audible
motor noise, increased step accuracy, and reduced power
dissipation.
Internal synchronous rectification control circuitry is provided
Packages :
to improve power dissipation during PWM operation.
The outputs are protected from shorted load and short-to-
24-contact QFN
4 mm × 4 mm × 0.75 mm
(ES package)
24-pin TSSOP
with exposed thermal pad
(LP Package)
Approximate size
ground events, which protect the driver and associated circuitry
from thermal damage or flare-ups. Other protection features
include thermal shutdown with hysteresis, undervoltage lockout
(UVLO) and crossover current protection. Special power-up
sequencing is not required.
The A4987 is supplied in two packages, a 24-contact QFN (ES)
and a 24-pin TSSOP (LP). Both packages have exposed thermal
pads for enhanced thermal performance. The 24-contact ES is
4 mm × 4 mm, with a nominal overall package height of 0.75
mm. The 24-pin LP is a TSSOP with 0.65 pitch and an overall
package height of ≤ 1.2 mm. Both packages are lead (Pb) free,
with 100% matte tin leadframe plating.
Typical Application Diagram
V DD
0.22 μ F
0.1 μ F
0.1 μ F
0.22 μ F
VREG ROSC
VDD
CP1
CP2
VCP
VBB1
VBB2
100 μ F
Microcontroller or
Controller Logic
SLEEP
IN01
IN02
A4987
OUT1A
OUT1B
SENSE1
PH1
IN11
IN12
PH2
OUT2A
OUT2B
VREF
GND
GND
SENSE2
4987-DS, Rev. 5
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