参数资料
型号: A54SX08-FGG144I
厂商: Microsemi SoC
文件页数: 16/64页
文件大小: 0K
描述: IC FPGA SX 12K GATES 144-FBGA
标准包装: 160
系列: SX
LAB/CLB数: 768
输入/输出数: 111
门数: 12000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 144-LBGA
供应商设备封装: 144-FPBGA(13x13)
SX Family FPGAs
v3.2
1-19
Figure 1-11 shows the characterized power dissipation numbers for the shift register design using frequencies ranging
from 1 MHz to 200 MHz.
Junction Temperature (TJ)
The temperature that you select in Designer Series
software is the junction temperature, not ambient
temperature. This is an important distinction because the
heat generated from dynamic power consumption is
usually hotter than the ambient temperature. Use the
equation below to calculate junction temperature.
Junction Temperature =
ΔT + T
a
EQ 1-13
Where:
Ta = Ambient Temperature
ΔT = Temperature gradient between junction (silicon)
and ambient
ΔT = θ
ja × P
P
= Power
calculated
from
Estimating
Power
Consumption section
θ
ja = Junction to ambient of package. θja numbers are
Package Thermal Characteristics
The device junction to case thermal characteristic is
θ
jc,
and the junction to ambient air characteristic is
θ
ja. The
thermal characteristics for
θ
ja are shown with two
different air flow rates.
The maximum junction temperature is 150
°C.
A sample calculation of the absolute maximum power
dissipation allowed for a TQFP 176-pin package at
commercial temperature and still air is as follows:
EQ 1-14
Figure 1-11 Power Dissipation
0
200
400
600
800
1000
1200
Frequency MHz
Power
Dissipation
mW
20
0
40
60
80
100
120
140
160
180
200
Maximum Power Allowed
Max. junction temp. (°C) – Max. ambient temp. (°C)
θ
ja (°C/W)
------------------------------------------------------------------------------------------------------------------------------------
150°C – 70°C
28°C/W
-----------------------------------
2.86 W
==
=
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