参数资料
型号: A54SX16A-1TQG144
厂商: Microsemi SoC
文件页数: 79/108页
文件大小: 0K
描述: IC FPGA SX 24K GATES 144-TQFP
标准包装: 60
系列: SX-A
LAB/CLB数: 1452
输入/输出数: 113
门数: 24000
电源电压: 2.25 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
SX-A Family FPGAs
2- 52
v5.3
Table 2-41 A54SX72A Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.25 V, VCCI = 4.75 V, TJ = 70°C)
Parameter
Description
–3 Speed1
–2 Speed
–1 Speed
Std. Speed
–F Speed
Units
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
5 V PCI Output Module Timing2
tDLH
Data-to-Pad Low to High
2.7
3.1
3.5
4.1
5.7
ns
tDHL
Data-to-Pad High to Low
3.4
3.9
4.4
5.1
7.2
ns
tENZL
Enable-to-Pad, Z to L
1.3
1.5
1.7
2.0
2.8
ns
tENZH
Enable-to-Pad, Z to H
2.7
3.1
3.5
4.1
5.7
ns
tENLZ
Enable-to-Pad, L to Z
3.0
3.5
3.9
4.6
6.4
ns
tENHZ
Enable-to-Pad, H to Z
3.4
3.9
4.4
5.1
7.2
ns
dTLH
3
Delta Low to High
0.016
0.02
0.022
0.032
ns/pF
dTHL
3
Delta High to Low
0.026
0.03
0.032
0.04
0.052
ns/pF
5 V TTL Output Module Timing4
tDLH
Data-to-Pad Low to High
2.4
2.8
3.1
3.7
5.1
ns
tDHL
Data-to-Pad High to Low
3.1
3.5
4.0
4.7
6.6
ns
tDHLS
Data-to-Pad High to Low—low slew
7.4
8.5
9.7
11.4
15.9
ns
tENZL
Enable-to-Pad, Z to L
2.1
2.4
2.7
3.2
4.5
ns
tENZLS
Enable-to-Pad, Z to L—low slew
7.4
8.4
9.5
11.0
15.4
ns
tENZH
Enable-to-Pad, Z to H
2.4
2.8
3.1
3.7
5.1
ns
tENLZ
Enable-to-Pad, L to Z
3.6
4.2
4.7
5.6
7.8
ns
tENHZ
Enable-to-Pad, H to Z
3.1
3.5
4.0
4.7
6.6
ns
dTLH
3
Delta Low to High
0.014
0.017
0.023
0.031
ns/pF
dTHL
3
Delta High to Low
0.023
0.029
0.031
0.037
0.051
ns/pF
dTHLS
3
Delta High to Low—low slew
0.043
0.046
0.057
0.066
0.089
ns/pF
Notes:
1. All –3 speed grades have been discontinued.
2. Delays based on 50 pF loading.
3. To obtain the slew rate, substitute the appropriate Delta value, load capacitance, and the VCCI value into the following equation:
Slew Rate [V/ns] = (0.1*VCCI – 0.9*VCCI)/ (Cload * dT[LH|HL|HLS])
where Cload is the load capacitance driven by the I/O in pF
dT[LH|HL|HLS] is the worst case delta value from the datasheet in ns/pF.
4. Delays based on 35 pF loading.
相关PDF资料
PDF描述
EPF10K10LC84-3 IC FLEX 10K FPGA 10K 84-PLCC
RCB66DHBR-S621 EDGECARD 132POS DIP R/A .050 SLD
A54SX16A-TQ144I IC FPGA SX 24K GATES 144-TQFP
A54SX16A-1TQ144 IC FPGA SX 24K GATES 144-TQFP
GSC60DRAN CONN EDGECARD 120PS R/A .100 SLD
相关代理商/技术参数
参数描述
A54SX16A-1TQG144I 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A54SX16A-1TQG144M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 16K GATES 924 CELLS 263MHZ 0.25UM/0.22UM 2.5V 144T - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 24K GATES 144TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 111 I/O 144TQFP
A54SX16A2 制造商:ACTEL 功能描述:*
A54SX16A-2FG144 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A54SX16A-2FG144I 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)