参数资料
型号: A54SX16P-1TQG144
厂商: Microsemi SoC
文件页数: 60/64页
文件大小: 0K
描述: IC FPGA SX 24K GATES 144-TQFP
标准包装: 60
系列: SX
LAB/CLB数: 1452
输入/输出数: 113
门数: 24000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
54SX Family FPGAs
v3.2
3-1
Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully
characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet
Supplement." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) containing general product
information. This brief gives an overview of specific device and family information.
Advanced
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
Datasheet Supplement
The datasheet supplement gives specific device information for a derivative family that differs from the general family
datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and
for specifications that do not differ between the two families.
International Traffic in Arms Regulations (ITAR) and Export
Administration Regulations (EAR)
The products described in this datasheet are subject to the International Traffic in Arms Regulations (ITAR) or the
Export Administration Regulations (EAR). They may require an approved export license prior to their export. An export
can include a release or disclosure to a foreign national inside or outside the United States.
Previous Version Changes in Current Version (v3.2)
Page
v3.1
(June 2003)
The "Ordering Information" was updated to include RoHS information.
The Product Plan was removed since all products have been released.
N/A
Information concerning the TRST pin in the "Probe Circuit Control Pins" section was removed.
A note was added to the "Power-Up Sequencing" table.
A note was added to the "Power-Down Sequencing" table. The 3.3 V comments were updated for the
following devices: A54SX08, A54SX16, A54SX32.
U11 and U13 were added to the "313-Pin PBGA" table.
v3.0.1
Storage temperature in Table 1-3 was updated.
Table 1-1 was updated.
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A54SX16P-1TQG144I 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX16P-1TQG144M 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A54SX16P-1TQG176 功能描述:IC FPGA SX 24K GATES 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16P-1TQG176I 功能描述:IC FPGA SX 24K GATES 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX16P-1VQ100 功能描述:IC FPGA SX 24K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)