参数资料
型号: A54SX16P-1TQG144I
厂商: Microsemi SoC
文件页数: 25/64页
文件大小: 0K
描述: IC FPGA SX 24K GATES 144-TQFP
标准包装: 60
系列: SX
LAB/CLB数: 1452
输入/输出数: 113
门数: 24000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
SX Family FPGAs
v3.2
1-27
Dedicated (Hardwired) Array Clock Network
tHCKH
Input LOW to HIGH (pad to R-Cell input)
1.2
1.4
1.5
1.8
ns
tHCKL
Input HIGH to LOW (pad to R-Cell input)
1.2
1.4
1.6
1.9
ns
tHPWH
Minimum Pulse Width HIGH
1.4
1.6
1.8
2.1
ns
tHPWL
Minimum Pulse Width LOW
1.4
1.6
1.8
2.1
ns
tHCKSW
Maximum Skew
0.2
0.3
ns
tHP
Minimum Period
2.7
3.1
3.6
4.2
ns
fHMAX
Maximum Frequency
350
320
280
240
MHz
Routed Array Clock Networks
tRCKH
Input LOW to HIGH (light load)
(pad to R-Cell input)
1.61.8
2.12.5
ns
tRCKL
Input HIGH to LOW (light load)
(pad to R-Cell input)
1.82.0
2.32.7
ns
tRCKH
Input LOW to HIGH (50% load)
(pad to R-Cell input)
1.82.1
2.52.8
ns
tRCKL
Input HIGH to LOW (50% load)
(pad to R-Cell input)
2.02.2
2.53.0
ns
tRCKH
Input LOW to HIGH (100% load)
(pad to R-Cell input)
1.82.1
2.42.8
ns
tRCKL
Input HIGH to LOW (100% load)
(pad to R-Cell input)
2.02.2
2.53.0
ns
tRPWH
Min. Pulse Width HIGH
2.1
2.4
2.7
3.2
ns
tRPWL
Min. Pulse Width LOW
2.1
2.4
2.7
3.2
ns
tRCKSW
Maximum Skew (light load)
0.5
0.7
ns
tRCKSW
Maximum Skew (50% load)
0.5
0.6
0.7
0.8
ns
tRCKSW
Maximum Skew (100% load)
0.5
0.6
0.7
0.8
ns
TTL Output Module Timing3
tDLH
Data-to-Pad LOW to HIGH
1.6
1.9
2.1
2.5
ns
tDHL
Data-to-Pad HIGH to LOW
1.6
1.9
2.1
2.5
ns
tENZL
Enable-to-Pad, Z to L
2.1
2.4
2.8
3.2
ns
tENZH
Enable-to-Pad, Z to H
2.3
2.7
3.1
3.6
ns
tENLZ
Enable-to-Pad, L to Z
1.4
1.7
1.9
2.2
ns
tENHZ
Enable-to-Pad, H to Z
1.3
1.5
1.7
2.0
ns
Table 1-18 A54SX16 Timing Characteristics (Continued)
(Worst-Case Commercial Conditions, VCCR = 4.75 V, VCCA ,VCCI = 3.0 V, TJ = 70°C)
Parameter
Description
'–3' Speed
'–2' Speed
'–1' Speed
'Std' Speed
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Units
Notes:
1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance.
Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route
timing is based on actual routing delay measurements performed on the device prior to shipment.
3. Delays based on 35 pF loading, except tENZL and tENZH. For tENZL and tENZH, the loading is 5 pF.
相关PDF资料
PDF描述
10336-3210-003 JUNCTION SHELL 36POS MED GRAY
M7A3P1000-FG484I IC FPGA 1KB FLASH 1M 484-FBGA
M7A3P1000-FGG484I IC FPGA 1KB FLASH 1M 484-FBGA
3485-2500R CONN D-SUB JUNCT SHELL 50POS
A54SX08-2TQG176I IC FPGA SX 12K GATES 176-TQFP
相关代理商/技术参数
参数描述
A54SX16P-1TQG144M 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A54SX16P-1TQG176 功能描述:IC FPGA SX 24K GATES 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16P-1TQG176I 功能描述:IC FPGA SX 24K GATES 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX16P-1VQ100 功能描述:IC FPGA SX 24K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16P-1VQ100I 功能描述:IC FPGA SX 24K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)