参数资料
型号: A54SX16P-PQG208M
厂商: Microsemi SoC
文件页数: 6/64页
文件大小: 0K
描述: IC FPGA SX 24K GATES 208-PQFP
标准包装: 24
系列: SX
LAB/CLB数: 1452
输入/输出数: 175
门数: 24000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: -55°C ~ 125°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
SX Family FPGAs
1- 10
v3.2
A54SX16P AC Specifications for (PCI Operation)
Table 1-7
A54SX16P AC Specifications for (PCI Operation)
Symbol
Parameter
Condition
Min.
Max.
Units
IOH(AC)
Switching Current High
0 < VOUT ≤ 1.4
1
–44
mA
1.4
≤ V
OUT < 2.4
1, 2
–44 + (VOUT – 1.4)/0.024
mA
3.1 < VOUT < VCC
1, 3
(Test Point)
VOUT = 3.1
3
–142
mA
IOL(AC)
Switching Current High
VOUT ≥ 2.2
1
95
mA
2.2 > VOUT > 0.55
1
VOUT/0.023
0.71 > VOUT > 0
1, 3
mA
(Test Point)
VOUT = 0.71
3
206
mA
ICL
Low Clamp Current
–5 < VIN ≤ –1
–25 + (VIN + 1) /0.015
mA
slewR
Output Rise Slew Rate
0.4 V to 2.4 V load4
15
V/ns
slewF
Output Fall Slew Rate
2.4 V to 0.4 V load4
15
V/ns
Notes:
1. Refer to the V/I curves in Figure 1-9 on page 1-11. Switching current characteristics for REQ# and GNT# are permitted to be one half
of that specified here; i.e., half-size output drivers may be used on these signals. This specification does not apply to CLK and RST#,
which are system outputs. “Switching Current High” specifications are not relevant to SERR#, INTA#, INTB#, INTC#, and INTD#,
which are open drain outputs.
2. Note that this segment of the minimum current curve is drawn from the AC drive point directly to the DC drive point rather than
toward the voltage rail (as is done in the pull-down curve). This difference is intended to allow for an optional N-channel pull-up.
3. Maximum current requirements must be met as drivers pull beyond the last step voltage. Equations defining these maximums (A
and B) are provided with the respective diagrams in Figure 1-9 on page 1-11. The equation defined maxima should be met by
design. In order to facilitate component testing, a maximum current test point is defined for each side of the output driver.
4. This parameter is to be interpreted as the cumulative edge rate across the specified range, rather than the instantaneous rate at any
point within the transition range. The specified load (diagram below) is optional; i.e., the designer may elect to meet this parameter
with an unloaded output per revision 2.0 of the PCI Local Bus Specification. However, adherence to both maximum and minimum
parameters is now required (the maximum is no longer simply a guideline). Since adherence to the maximum slew rate was not
required prior to revision 2.1 of the specification, there may be components in the market for some time that have faster edge rates;
therefore, motherboard designers must bear in mind that rise and fall times faster than this specification could occur, and should
ensure that signal integrity modeling accounts for this. Rise slew rate does not apply to open drain outputs.
1/2 in. max.
Pin
Output
Buffer
VCC
10 pF
1 k
Ω
1 k
Ω
相关PDF资料
PDF描述
EP1S20F672I7N IC STRATIX FPGA 20K LE 672-FBGA
IDT70V25L15PFG IC SRAM 128KBIT 15NS 100TQFP
IDT70V06L25PFI IC SRAM 128KBIT 25NS 64TQFP
EP2AGX45DF25I5N IC ARRIA II GX FPGA 45K 572FBGA
EP2AGX45DF25C4N IC ARRIA II GX FPGA 45K 572FBGA
相关代理商/技术参数
参数描述
A54SX16-PQ208 功能描述:IC FPGA SX 24K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16-PQ208I 功能描述:IC FPGA SX 24K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16-PQG208 功能描述:IC FPGA SX 24K GATES 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16-PQG208I 功能描述:IC FPGA SX 24K GATES 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16P-TQ144 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)