参数资料
型号: A54SX32-2PQG208
厂商: Microsemi SoC
文件页数: 26/64页
文件大小: 0K
描述: IC FPGA SX 48K GATES 208-PQFP
标准包装: 24
系列: SX
LAB/CLB数: 2880
输入/输出数: 174
门数: 48000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
SX Family FPGAs
1- 28
v3.2
A54SX16P Timing Characteristics
Table 1-19 A54SX16P Timing Characteristics
(Worst-Case Commercial Conditions, VCCR = 4.75 V, VCCA,VCCI = 3.0 V, TJ = 70°C)
Parameter
Description
'–3' Speed
'–2' Speed
'–1' Speed
'Std' Speed
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Units
C-Cell Propagation Delays1
tPD
Internal Array Module
0.6
0.7
0.8
0.9
ns
Predicted Routing Delays2
tDC
FO = 1 Routing Delay, Direct Connect
0.1
ns
tFC
FO = 1 Routing Delay, Fast Connect
0.3
0.4
0.5
ns
tRD1
FO = 1 Routing Delay
0.3
0.4
0.5
ns
tRD2
FO = 2 Routing Delay
0.6
0.7
0.8
0.9
ns
tRD3
FO = 3 Routing Delay
0.8
0.9
1.0
1.2
ns
tRD4
FO = 4 Routing Delay
1.0
1.2
1.4
1.6
ns
tRD8
FO = 8 Routing Delay
1.9
2.2
2.5
2.9
ns
tRD12
FO = 12 Routing Delay
2.8
3.2
3.7
4.3
ns
R-Cell Timing
tRCO
Sequential Clock-to-Q
0.9
1.1
1.3
1.4
ns
tCLR
Asynchronous Clear-to-Q
0.5
0.6
0.7
0.8
ns
tPRESET
Asynchronous Preset-to-Q
0.7
0.8
0.9
1.0
ns
tSUD
Flip-Flop Data Input Set-Up
0.5
0.7
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
ns
tWASYN
Asynchronous Pulse Width
1.4
1.6
1.8
2.1
ns
Input Module Propagation Delays
tINYH
Input Data Pad-to-Y HIGH
1.5
1.7
1.9
2.2
ns
tINYL
Input Data Pad-to-Y LOW
1.5
1.7
1.9
2.2
ns
Predicted Input Routing Delays2
tIRD1
FO = 1 Routing Delay
0.3
0.4
0.5
ns
tIRD2
FO = 2 Routing Delay
0.6
0.7
0.8
0.9
ns
tIRD3
FO = 3 Routing Delay
0.8
0.9
1.0
1.2
ns
tIRD4
FO = 4 Routing Delay
1.0
1.2
1.4
1.6
ns
tIRD8
FO = 8 Routing Delay
1.9
2.2
2.5
2.9
ns
tIRD12
FO = 12 Routing Delay
2.8
3.2
3.7
4.3
ns
Note:
1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route
timing is based on actual routing delay measurements performed on the device prior to shipment.
3. Delays based on 10 pF loading.
相关PDF资料
PDF描述
93C66B-I/P IC EEPROM 4KBIT 2MHZ 8DIP
93LC66B/P IC EEPROM 4KBIT 2MHZ 8DIP
93C56C-I/ST IC EEPROM 2KBIT 3MHZ 8TSSOP
205210-7 CONN D-SUB HOUSING PLUG 37POS
11AA160-I/TO EEPROM SER 16KBIT TO-92
相关代理商/技术参数
参数描述
A54SX32-2PQG208I 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX32-2TQ144 功能描述:IC FPGA SX 48K GATES 144-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX32-2TQ144I 功能描述:IC FPGA SX 48K GATES 144-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX32-2TQ176 功能描述:IC FPGA SX 48K GATES 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX32-2TQ176I 功能描述:IC FPGA SX 48K GATES 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)