参数资料
型号: A54SX32A-1PQ208
厂商: Microsemi SoC
文件页数: 79/108页
文件大小: 0K
描述: IC FPGA SX 48K GATES 208-PQFP
标准包装: 24
系列: SX-A
LAB/CLB数: 2880
输入/输出数: 174
门数: 48000
电源电压: 2.25 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
SX-A Family FPGAs
2- 52
v5.3
Table 2-41 A54SX72A Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.25 V, VCCI = 4.75 V, TJ = 70°C)
Parameter
Description
–3 Speed1
–2 Speed
–1 Speed
Std. Speed
–F Speed
Units
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
5 V PCI Output Module Timing2
tDLH
Data-to-Pad Low to High
2.7
3.1
3.5
4.1
5.7
ns
tDHL
Data-to-Pad High to Low
3.4
3.9
4.4
5.1
7.2
ns
tENZL
Enable-to-Pad, Z to L
1.3
1.5
1.7
2.0
2.8
ns
tENZH
Enable-to-Pad, Z to H
2.7
3.1
3.5
4.1
5.7
ns
tENLZ
Enable-to-Pad, L to Z
3.0
3.5
3.9
4.6
6.4
ns
tENHZ
Enable-to-Pad, H to Z
3.4
3.9
4.4
5.1
7.2
ns
dTLH
3
Delta Low to High
0.016
0.02
0.022
0.032
ns/pF
dTHL
3
Delta High to Low
0.026
0.03
0.032
0.04
0.052
ns/pF
5 V TTL Output Module Timing4
tDLH
Data-to-Pad Low to High
2.4
2.8
3.1
3.7
5.1
ns
tDHL
Data-to-Pad High to Low
3.1
3.5
4.0
4.7
6.6
ns
tDHLS
Data-to-Pad High to Low—low slew
7.4
8.5
9.7
11.4
15.9
ns
tENZL
Enable-to-Pad, Z to L
2.1
2.4
2.7
3.2
4.5
ns
tENZLS
Enable-to-Pad, Z to L—low slew
7.4
8.4
9.5
11.0
15.4
ns
tENZH
Enable-to-Pad, Z to H
2.4
2.8
3.1
3.7
5.1
ns
tENLZ
Enable-to-Pad, L to Z
3.6
4.2
4.7
5.6
7.8
ns
tENHZ
Enable-to-Pad, H to Z
3.1
3.5
4.0
4.7
6.6
ns
dTLH
3
Delta Low to High
0.014
0.017
0.023
0.031
ns/pF
dTHL
3
Delta High to Low
0.023
0.029
0.031
0.037
0.051
ns/pF
dTHLS
3
Delta High to Low—low slew
0.043
0.046
0.057
0.066
0.089
ns/pF
Notes:
1. All –3 speed grades have been discontinued.
2. Delays based on 50 pF loading.
3. To obtain the slew rate, substitute the appropriate Delta value, load capacitance, and the VCCI value into the following equation:
Slew Rate [V/ns] = (0.1*VCCI – 0.9*VCCI)/ (Cload * dT[LH|HL|HLS])
where Cload is the load capacitance driven by the I/O in pF
dT[LH|HL|HLS] is the worst case delta value from the datasheet in ns/pF.
4. Delays based on 35 pF loading.
相关PDF资料
PDF描述
RBB92DHAR-S250 EDGECARD PCI 184POS .050 R/A 5V
FMC19DRYN-S13 CONN EDGECARD 38POS .100 EXTEND
FMC19DRYH-S13 CONN EDGECARD 38POS .100 EXTEND
HMC35DRAN CONN EDGECARD 70POS R/A .100 SLD
5747099-1 CONN BACKSHELL DB15 METAL PLATED
相关代理商/技术参数
参数描述
A54SX32A-1PQ208I 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX32A-1PQ208M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 278MHZ 0.25UM/0.22UM 2.5V 208 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 174 I/O 208PQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 208PQFP
A54SX32A-1PQG208 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX32A-1PQG208I 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX32A-1PQG208M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 278MHZ 0.25UM/0.22UM 2.5V 208 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 174 I/O 208PQFP