参数资料
型号: A54SX72A-FGG484A
厂商: Microsemi SoC
文件页数: 67/108页
文件大小: 0K
描述: IC FPGA SX-A 108K 484-FBGA
标准包装: 40
系列: SX-A
LAB/CLB数: 6036
输入/输出数: 360
门数: 108000
电源电压: 2.25 V ~ 5.25 V
安装类型: 表面贴装
工作温度: -40°C ~ 125°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(27X27)
SX-A Family FPGAs
v5.3
2-41
Table 2-34 A54SX32A Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.25 V, VCCI = 4.75 V, TJ = 70°C)
Parameter
Description
–3 Speed1
–2 Speed
–1 Speed
Std. Speed
–F Speed
Units
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
5 V PCI Output Module Timing2
tDLH
Data-to-Pad Low to High
2.1
2.4
2.8
3.2
4.5
ns
tDHL
Data-to-Pad High to Low
2.8
3.2
3.6
4.2
5.9
ns
tENZL
Enable-to-Pad, Z to L
1.3
1.5
1.7
2.0
2.8
ns
tENZH
Enable-to-Pad, Z to H
2.1
2.4
2.8
3.2
4.5
ns
tENLZ
Enable-to-Pad, L to Z
3.0
3.5
3.9
4.6
6.4
ns
tENHZ
Enable-to-Pad, H to Z
2.8
3.2
3.6
4.2
5.9
ns
dTLH
3
Delta Low to High
0.016
0.02
0.022
0.032
ns/pF
dTHL
3
Delta High to Low
0.026
0.03
0.032
0.04
0.052
ns/pF
5 V TTL Output Module Timing4
tDLH
Data-to-Pad Low to High
1.9
2.2
2.5
2.9
4.1
ns
tDHL
Data-to-Pad High to Low
2.5
2.9
3.3
3.9
5.4
ns
tDHLS
Data-to-Pad High to Low—low slew
6.6
7.6
8.6
10.1
14.2
ns
tENZL
Enable-to-Pad, Z to L
2.1
2.4
2.7
3.2
4.5
ns
tENZLS
Enable-to-Pad, Z to L—low slew
7.4
8.4
9.5
11.0
15.4
ns
tENZH
Enable-to-Pad, Z to H
1.9
2.2
2.5
2.9
4.1
ns
tENLZ
Enable-to-Pad, L to Z
3.6
4.2
4.7
5.6
7.8
ns
tENHZ
Enable-to-Pad, H to Z
2.5
2.9
3.3
3.9
5.4
ns
dTLH
3
Delta Low to High
0.014
0.017
0.023
0.031
ns/pF
dTHL
3
Delta High to Low
0.023
0.029
0.031
0.037
0.051
ns/pF
dTHLS
3
Delta High to Low—low slew
0.043
0.046
0.057
0.066
0.089
ns/pF
Notes:
1. All –3 speed grades have been discontinued.
2. Delays based on 50 pF loading.
3. To obtain the slew rate, substitute the appropriate Delta value, load capacitance, and the VCCI value into the following equation:
Slew Rate [V/ns] = (0.1*VCCI – 0.9*VCCI)/ (Cload * dT[LH|HL|HLS])
where Cload is the load capacitance driven by the I/O in pF
dT[LH|HL|HLS] is the worst case delta value from the datasheet in ns/pF.
4. Delays based on 35 pF loading.
相关PDF资料
PDF描述
11AA010-I/TO EEPROM SER 1KBIT TO-92
11AA080-I/TO EEPROM SER 8KBIT TO-92
205203-8 CONN D-SUB HOUSING RECEPT 9POS
93AA46B-I/ST IC EEPROM 1KBIT 2MHZ 8TSSOP
93C46A-I/ST IC EEPROM 1KBIT 2MHZ 8TSSOP
相关代理商/技术参数
参数描述
A54SX72A-FGG484I 功能描述:IC FPGA SX-A 108K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A54SX72A-FGG484M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 72K Gates 4024 Cells 217MHz 0.25um Technology 2.5V 484-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA SX-A 72K GATES 4024 CELLS 217MHZ 0.25UM/0.22UM 2.5V 484 - Trays
A54SX72A-FPQ208 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX72A-FPQG208 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX72A-PQ208 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)