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参数资料
| 型号： | A82DL1622UG-70IF |
| 厂商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| 中文描述： | 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL16x2T（ü）16兆位（2Mx8 Bit/1Mx16位）的CMOS 3.3伏只，同时闪电行动 |
| 文件页数： | 35/57页 |
| 文件大小： | 883K |
| 代理商： | A82DL1622UG-70IF |
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A82DL16x2T(U) Series
PRELIMINARY
(May, 2005, Version 0.1)
34
AMIC Technology, Corp.
AC CHARACTERISTICS
Read Only Operations
Parameter
Speed
JEDEC
Std
Description
Test Setup
-70
Unit
t
AVAV
t
RC
Read Cycle Time (Note 1)
Min.
70
ns
t
AVQV
t
ACC
Address to Output Delay
CE_F
= V
IL
OE
= V
IL
Max.
70
ns
t
ELQV
t
CE
Chip Enable to Output Delay
OE
= V
IL
Max.
70
ns
t
GLQV
t
OE
Output Enable to Output Delay
Max.
30
ns
t
EHQZ
t
DF
Chip Enable to Output High Z
(Notes 1,3)
Output Enable to Output High Z
(Notes 1,3)
Max.
16
ns
t
GHQZ
t
DF
Max.
16
ns
t
AXQX
t
OH
Output Hold Time from Addresses,
CE
or
OE
,
Whichever Occurs First
Min.
0
ns
Read
Min.
0
ns
t
OEH
Output Enable Hold Time
(Note 1)
Toggle and
Data
Polling
Min.
10
ns
Notes:
1. Not 100% tested.
2. See Figure 9 and Table 14 for test specifications.
3. Measurements performed by placing a 50-ohm termination on the data pin with a bias of (VCC_F)/2. The time from
OE
high
to the data bus driven to (VCC_F)/2 is taken as t
DF
.
Figure 11. Read Operation Timings
Addresses
Addresses Stable
CE_F
OE
WE
Output Valid
High-Z
Output
t
RC
t
OEH
t
OE
t
CE
High-Z
t
OH
t
DF
t
ACC
0V
RESET
RY/BY
t
RH
t
RH
相关PDF资料 |
PDF描述 |
|---|---|
| A82DL1622UG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1622UG-70UF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632TG-70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1642TG-70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632TG-70F | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A82DL1622UG-70U | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1622UG-70UF | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1624 | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70 | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70F | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
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