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参数资料
| 型号： | A82DL1632TG-70U |
| 厂商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| 中文描述： | 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL16x2T（ü）16兆位（2Mx8 Bit/1Mx16位）的CMOS 3.3伏只，同时闪电行动 |
| 文件页数： | 57/57页 |
| 文件大小： | 883K |
| 代理商： | A82DL1632TG-70U |
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A82DL16x2T(U) Series
PRELIMINARY
(May, 2005, Version 0.1)
56
AMIC Technology, Corp.
Package Information
69LD STF BGA (8 x 11mm) Outline Dimensions
unit: mm
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
-A-
-B-
Pin #1
D
E
aaa
aaa
See Detail A
9 10
D
1
e
E
1
-C-
ccc C
CAVITY
SEATING PLANE
SOLDER BALL
c
A
1
A
2
A
1
2
3
A
B
C
See Detail B
b
Detail A
Detail B
C
ddd
eee
M
C
M
A B
// bbb C
Dimensions in mm
Min
Nom
-
0.25
0.30
0.91
0.96
0.22
0.26
7.90
8.00
10.90
11.00
-
7.20
-
7.20
-
0.80
0.35
0.40
0.15
0.20
0.12
0.15
0.08
10/10
Dimensions in inches
Min
Nom
-
-
0.010
0.012
0.036
0.038
0.009
0.010
0.311
0.315
0.429
0.433
-
0.283
-
0.283
-
0.031
0.14
0.16
0.006
0.008
0.005
0.006
0.003
10/10
Symbol
Max
1.40
0.35
1.01
0.30
8.10
11.10
-
-
-
0.45
Max
0.055
0.014
0.040
0.012
0.319
0.437
-
-
-
0.18
A
A
1
A
2
c
D
E
D1
E1
e
b
aaa
bbb
ccc
ddd
eee
MD/ME
-
Notes:
1. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
2. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL
DIAMETER, PARALLEL TO PRIMARY DATUM C.
3. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN
THE EDGE OF THE SOLDER BALL AND THE BODY EDGE.
4. REFERENCE DOCUMENT : JEDEC MO-219
5. THE PATTERN OF PIN 1 FIDUCIAL IS FOR REFERENCE ONLY.
相关PDF资料 |
PDF描述 |
|---|---|
| A82DL1642TG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1642UG-70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70F | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1642UG-70F | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A82DL1632TG-70UF | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70 | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70F | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70I | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70IF | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
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