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| 型号： | AA022P1-65 |
| 元件分类： | 放大器 |
| 英文描述： | 18000 MHz - 23000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 文件页数： | 4/4页 |
| 文件大小： | 669K |
| 代理商： | AA022P1-65 |
18–23 GHz Power Amplifier
AA022P1-65
4
Alpha Industries, Inc. [781] 935-5150
Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com
Specifications subject to change without notice. 2/00A
Leaded Millimeterwave Package Handling
and Mounting
The leaded millimeterwave package requires careful
mounting design to maintain optimal performance.
Handling
The leaded millimeterwave package is extremely rugged.
Care should be exercised when handling with metal tools.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Package Construction
The construction of the leaded millimeterwave package
consists of a metal base and ceramic walls. The
package is topped by a solder-sealed metal lid. All metal
parts are gold-plated.
Mounting Design
The leaded millimeterwave package is mounted by placing
it in a hole cut in a printed circuit board. The bottom of the
package leads should be in the same plane as the top
surface of the printed circuit board traces. The hole should
be cut as close as possible to the outer dimensions of the
package to minimize the gap between package and
printed circuit board. The gap should be no more than
0.005" (0.127 mm). The base of the package should be
mounted directly to a surface that provides a good ground
plane for the printed circuit board and provides a good
thermal ground.
Mounting the Package
The leaded millimeterwave package should be attached
to its mounting surface using a silver-filled conductive
paste epoxy or solder. Care should be taken to ensure that
there are no voids or gaps in the epoxy or solder underfill
so that a good ground contact is maintained.
Screw hardware attachment should be used in addition
to epoxy or solder in situations where additional
mechanical integrity is desired. Care should be exercised
when tightening screws because over-tightening could
deform the package base.
Connecting the Package
Connection of the package leads to the printed circuit
board traces is accomplished with solder. Attached leads
should lie flat upon the printed circuits board traces.
Package leads can be trimmed if desired.
Leaded Millimeterwave Package Mounting
Printed Circuit Board
Rogers 4003
0.008" (0.20 mm) Thick
Electrically & Thermally
Conductive Ground Plane
Minimize RF
Gap Widths
Soldered Leads
RF In
RF Out
DC Connection
0–80 Screw
相关PDF资料 |
PDF描述 |
|---|---|
| AA022P1-65 | 18000 MHz - 23000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AA022P2-00 | 21000 MHz - 23000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AA028N1-00 | 24000 MHz - 30000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AA028N2-00 | 25000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AA028P4-00 | 23000 MHz - 30000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AA022P2-00 | 制造商:ALPHA 制造商全称:ALPHA 功能描述:21-23 GHz GaAs MMIC Medium Power Amplifier |
| AA-0237-1 | 制造商:JMK 制造商全称:JMK 功能描述:The 237 Series is designed to provide more aggressive performance than the 220 or 221 series. |
| AA-0237-10 | 制造商:JMK 制造商全称:JMK 功能描述:The 237 Series is designed to provide more aggressive performance than the 220 or 221 series. |
| AA-0237-3 | 制造商:JMK 制造商全称:JMK 功能描述:The 237 Series is designed to provide more aggressive performance than the 220 or 221 series. |
| AA-0237-5 | 制造商:JMK 制造商全称:JMK 功能描述:The 237 Series is designed to provide more aggressive performance than the 220 or 221 series. |
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