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参数资料
| 型号： | ACPL-5700L |
| 元件分类： | 光电耦合器 |
| 英文描述： | 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER |
| 封装： | HERMETIC SEALED, CERAMIC, DIP-8 |
| 文件页数： | 4/11页 |
| 文件大小： | 963K |
| 代理商： | ACPL-5700L |
2
Functional Diagram
Multiple Channel Devices Available
Package styles for these parts are 8 and 16 pin DIP through
hole (case outlines P and E respectively). Devices may be
purchased with a variety of lead bend and plating options.
See Selection Guide table for details. Standard Military
Drawing (SMD) parts are available for each package and
lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and perfor-
mance characteristics shown in the figures are similar for
all parts except as noted. Additionally, the same package
assembly processes and materials are used in all devices.
These similarities justify the use of a common data base for
die related reliability.
Truth Table
(Positive Logic)
Input
Output
On (H)
L
Off (L)
H
7
5
6
8
2
3
4
1
Selection Guide – Package Styles and Lead Configuration Options
Package
16 Pin DIP
8 Pin DIP
Lead Style
Through Hole
Channels
4
1
2
Common Channel Wiring
VCC, GND
None
VCC, GND
Avago Part # & Options
Commercial
ACPL-1770L
ACPL-5700L
ACPL-5730L
MIL-PRF-38534, Class H
ACPL-1772L
ACPL-5701L
ACPL-5731L
MIL-PRF-38534, Class K
ACPL-177KL
ACPL-570KL
ACPL-573KL
Standard Lead Finish
Gold Plate
Solder Dipped*
Option -200
Butt Cut/Gold Plate
Option -100
Gull Wing/Soldered*
Option -300
Class H SMD Part #
Prescript for all below
5962-
Either Gold or Solder
0822703HEX
0822701HPX
0822702HPX
Gold Plate
0822703HEC
0822701HPC
0822702HPC
Solder Dipped*
0822703HEA
0822701HPA
0822702HPA
Butt Cut/Gold Plate
0822703HUC
0822701HYC
0822702HYC
Butt Cut/Soldered*
0822703HUA
0822701HYA
0822702HYA
Gull Wing/Soldered*
0822703HTA
0822701HXA
0822702HXA
Class K SMD Part #
Prescript for all below
5962-
Either Gold or Solder
0822703KEX
0822701KPX
0822702KPX
Gold Plate
0822703KEC
0822701KPC
0822702KPC
Solder Dipped*
0822703KEA
0822701KPA
0822702KPA
Butt Cut/Gold Plate
0822703KUC
0822701KYC
0822702KYC
Butt Cut/Soldered*
0822703KUA
0822701KYA
0822702KYA
Gull Wing/Soldered*
0822703KTA
0822701KXA
0822702KXA
* Solder contains lead.
相关PDF资料 |
PDF描述 |
|---|---|
| ACPL-5731L-100 | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER |
| ACPL-573KL | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER |
| ACPL-847 | 4 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER |
| ACPL-827-W00 | 2 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER |
| ACPL-827-060 | 2 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ACPL-5700L-100 | 功能描述:逻辑输出光电耦合器 3.3V 1CH 1500Vdc Hermetically sealed RoHS:否 制造商:Fairchild Semiconductor 绝缘电压:4243 Vrms 输出类型:Push-Pull 最大传播延迟时间:500 ns 最大正向二极管电压: 最大反向二极管电压: 最大正向二极管电流: 最大连续输出电流:2.5 A 最大功率耗散:100 mW 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:SO-16 封装:Tube |
| ACPL-5700L-200 | 功能描述:逻辑输出光电耦合器 3.3V 1CH 1500Vdc Hermetically sealed RoHS:否 制造商:Fairchild Semiconductor 绝缘电压:4243 Vrms 输出类型:Push-Pull 最大传播延迟时间:500 ns 最大正向二极管电压: 最大反向二极管电压: 最大正向二极管电流: 最大连续输出电流:2.5 A 最大功率耗散:100 mW 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:SO-16 封装:Tube |
| ACPL-5700L-300 | 功能描述:逻辑输出光电耦合器 3.3V 1CH 1500Vdc Hermetically sealed RoHS:否 制造商:Fairchild Semiconductor 绝缘电压:4243 Vrms 输出类型:Push-Pull 最大传播延迟时间:500 ns 最大正向二极管电压: 最大反向二极管电压: 最大正向二极管电流: 最大连续输出电流:2.5 A 最大功率耗散:100 mW 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:SO-16 封装:Tube |
| ACPL-5701L | 功能描述:逻辑输出光电耦合器 3.3V 1CH 1500Vdc Hermetically sealed RoHS:否 制造商:Fairchild Semiconductor 绝缘电压:4243 Vrms 输出类型:Push-Pull 最大传播延迟时间:500 ns 最大正向二极管电压: 最大反向二极管电压: 最大正向二极管电流: 最大连续输出电流:2.5 A 最大功率耗散:100 mW 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:SO-16 封装:Tube |
| ACPL-5701L-100 | 功能描述:逻辑输出光电耦合器 3.3V 1CH 1500Vdc Hermetically sealed RoHS:否 制造商:Fairchild Semiconductor 绝缘电压:4243 Vrms 输出类型:Push-Pull 最大传播延迟时间:500 ns 最大正向二极管电压: 最大反向二极管电压: 最大正向二极管电流: 最大连续输出电流:2.5 A 最大功率耗散:100 mW 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:SO-16 封装:Tube |
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