参数资料
型号: ACPM-5204-TR1
元件分类: 放大器
英文描述: 1710 MHz - 1755 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
封装: 3 X 3 MM, GREEN PACKAGE-10
文件页数: 10/13页
文件大小: 314K
代理商: ACPM-5204-TR1
6
Metallization
Solder Mask Opening
Solder Paste Stencil Aperture
PCB Design Guidelines
The recommended PCB land pattern is shown in gures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across
the I/O pads or conductive paddle to adjacent I/O pads.
Considering the fact that solder paste thickness will
directly aect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required ne stencil outline.
Note: Please put isolation and RF out lines in dierent layers for better
isolation
0.30
0.60
0.35
0.55
0.45
on 0.5mm pitch
0.3mm
0.475
0.65
0.45
0.50
0.60
1.50
1.30
0.525
0.55
0.45
1.10
0.60
0.35
0.475
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