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参数资料
| 型号： | ACPM-7311-OR1 |
| 元件分类： | 放大器 |
| 英文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封装： | 4 X 4 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, PLASTIC, 10 PIN |
| 文件页数： | 4/16页 |
| 文件大小： | 728K |
| 代理商： | ACPM-7311-OR1 |
2
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device, de-
structive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive
to damage induced by absorbed moisture and tempera-
ture.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three con-
secutive simulated reflows.
The out of bag exposure time maximum limits are deter-
mined by the classification test describe below which cor-
responds to a MSL classification level 6 to 1 according to
the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033.
ACPM-7311 is MSL3. Thus, according to the J-STD-033
p.11 the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature for
the ACPM-7311 is targeted at 260°C +0/-5°C. Figure 20
and Table 8 show typical SMT profile for maximum tem-
perature of 260 +0/-5°C.
Table 7. Moisture Classification Level and Floor Life
MSL
Level
Floor Life (out of bag) at factory ambient
=< 30°C/60% RH or as stated
Unlimited at =< 30°C/85% RH
2
year
2a
4 weeks
3
68 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
Table 6. ESD Classification
Pin #
Name
Description
HBM
CDM
Classification
Ven
Enable Voltage
± 2000V
± 200V
Class 2
2
Vmode0
Mode Control
± 2000V
± 200V
Class 2
3
Vmode
Mode Control
± 2000V
± 200V
Class 2
4
RF In
RF Input
± 2000V
± 200V
Class 2
5
Vcc
Supply Voltage
± 2000V
± 200V
Class 2
6
Vcc2
Supply Voltage
± 2000V
± 200V
Class 2
7
GND
Ground
± 2000V
± 200V
Class 2
8
RF Out
RF Output
± 2000V
± 200V
Class 2
9
GND
Ground
± 2000V
± 200V
Class 2
0
GND
Ground
± 2000V
± 200V
Class 2
Note :
1. Module products should be considered extremely ESD sensitive.
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相关代理商/技术参数 |
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| ACPM-7311-TR1 | 功能描述:射频放大器 UMTS800 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7312-BLK | 功能描述:射频放大器 UMTS PA Module Band 5 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7312-TR1 | 功能描述:射频放大器 UMTS PA Module Band 5 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7331-BLK | 功能描述:射频放大器 UMTS1900 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7331-BLKR | 功能描述:射频放大器 UMTS1900 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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