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参数资料
| 型号： | ACPM-7331 |
| 元件分类： | 放大器 |
| 英文描述： | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封装： | 4 X 4 MM, 1.10 MM HEIGHT, PLASTIC PACKAGE-10 |
| 文件页数： | 5/14页 |
| 文件大小： | 331K |
| 代理商： | ACPM-7331 |
Storage Condition
Packages described in this
document must be stored in
sealed moisture barrier, anti-
static bags. Shelf life in a sealed
moisture barrier bag is
12 months at <40℃ and 90%
relative humidity (RH)
J-STD-033 p.7.
Out-of-Bag Time Duration
After unpacking the device must
be soldered to the PCB within
168 hours as listed in the
J-STD-020B p.11 with factory
conditions <30℃ and 60% RH.
Baking
It is not necessary to re-bake the
part if both conditions (storage
conditions and out-of bag
conditions) have been satisfied.
Baking must be done if at least
one of the conditions above have
not been satisfied. The baking
conditions are 125℃ for 12 hours
J-STD-033 p.8.
CAUTION: Tape and reel materi-
als typically cannot be baked at
the temperature described above.
If out-of-bag exposure time is
exceeded, parts must be baked
for a longer time at low
temperatures, or the parts must
be de-reeled, de-taped, re-baked
and then put back on tape and
reel. (See moisture sensitive
warning label on each shipping
bag for information of baking).
Board Rework
Component Removal, Rework
and Remount
If a component is to be removed
from the board, it is recom-
mended that localized heating be
used and the maximum body
temperatures of any surface
mount component on the board
not exceed 200℃. This method
will minimize moisture related
component damage. If any
component temperature exceeds
200℃, the board must be baked
dry per 4-2 prior to rework and/
or component removal. Compo-
nent temperatures shall be
measured at the top center of the
package body. Any SMD packages
that have not exceeded their
floor life can be exposed to a
maximum body temperature as
high as their specified maximum
reflow temperature.
Removal for Failure Analysis
Not following the above requirements
may cause moisture/reflow
damage that could hinder or
completely prevent the determi-
nation of the original failure
mechanism.
Baking of Populated Boards
Some SMD packages and board
materials are not able to with-
stand long duration bakes at
125℃. Examples of this are some
FR-4 materials, which cannot
withstand a 24 hr bake at 125℃.
Batteries and electrolytic capaci-
tors are also temperature
sensitive. With component and
board temperature restrictions in
mind, choose a bake temperature
from Table 4-1 in J-STD 033; then
determine the appropriate bake
duration based on the component
to be removed. For additional
considerations see IPC-7711 and
IPC-7721.
Derating due to Factory Environmen-
tal Conditions
Factory floor life exposures for
SMD packages removed from the
dry bags will be a function of the
ambient environmental condi-
tions. A safe, yet conservative,
handling approach is to expose
the SMD packages only up to the
maximum time limits for each
moisture sensitivity level as
shown in Table 7. This approach,
however, does not work if the
factory humidity or temperature
are greater than the testing
conditions of 30℃/60% RH. A
solutions for addressing this
problem is to derate the expo-
sure times based on the knowl-
edge of moisture diffusion in the
component package materials
(ref. JESD22-A120). Recom-
mended equivalent total floor life
exposures can be estimated for a
range of humidities and tempera-
tures based on the nominal
plastic thickness for each device.
Table 9 lists equivalent derated
floor lives for humidities ranging
from 20-90% RH for three tem-
perature, 20℃,25℃, and 30℃.
This table is applicable to SMDs
molded with novolac, biphenyl or
multifunctional epoxy mold
compounds. The following
assumptions were used in
calculating Table 9:
1.Activation Energy for diffu-
sion = 0.35eV (smallest known
value).
2. For ≤60% RH, use Diffusivity =
0.121exp ( -0.35eV/kT) mm2/s
(this used smallest known
Diffusivity @ 30℃).
3. For >60% RH, use Diffusivity =
1.320exp ( -0.35eV/kT) mm2/s
(this used largest known
Diffusivity @ 30℃).
相关PDF资料 |
PDF描述 |
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| ACPM-7372-TR1 | 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
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相关代理商/技术参数 |
参数描述 |
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| ACPM-7331-BLK | 功能描述:射频放大器 UMTS1900 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7331-BLKR | 功能描述:射频放大器 UMTS1900 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7331-OR1 | 功能描述:射频放大器 UMTS1900 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7331-TR1 | 功能描述:射频放大器 UMTS1900 Power Amp Module RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ACPM-7332-BLK | 功能描述:射频放大器 UMTS PA Module Band 2 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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