参数资料
型号: ACPM-7371-TR1
元件分类: 放大器
英文描述: 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封装: 4 X 4 MM, 1.10 MM HEIGHT, ROHS COMPLIANT PACKAGE-10
文件页数: 4/15页
文件大小: 850K
代理商: ACPM-7371-TR1
Table 6. Moisture Classification Level and Floor Life
MSL Level
Floor Life (out of bag) at factory ambient
≤ 30°C/60% RH or as stated
1
Unlimited at
30°C/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device, de-
structive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive
to damage induced by absorbed moisture and tempera-
ture.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three con-
secutive simulated reflows.
The out of bag exposure time maximum limits are de-
termined by the classification test describe below which
corresponds to a MSL classification level 6 to 1 according
to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-
033.
ACPM-7381 is MSL3. Thus, according to the J-STD-033
p.11 the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature for
the ACPM-7381 is targeted at 260° +0/-5°C. Figure 17 and
Table 7 show typical SMT profile for maximum tempera-
ture of 260 +0/-5°C.
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