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参数资料
| 型号： | ACPM-7392-TR1 |
| 元件分类： | 放大器 |
| 英文描述： | 1750 MHz - 1785 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封装： | 4 X 4 MM, GREEN PACKAGE-10 |
| 文件页数： | 2/18页 |
| 文件大小： | 751K |
| 代理商： | ACPM-7392-TR1 |
10
PCB Design Guidelines
The recommended PCB land pattern is shown in fig-
ures on the left side. The substrate is coated with solder
mask between the I/O and conductive paddle to protect
the gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across
the I/O pads or conductive paddle to adjacent I/O pads.
Considering the fact that solder paste thickness will di-
rectly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required fine stencil outline.
Solder Paste Stencil Aperture
Solder Mask Opening
Metallization
0.3mm
on 0.6mm pitch
0.25
0.85
0.4
0.6
0.5
0.1
0.7
0.5
0.55
0.85
2.4
1.8
0.6
0.5
1.6
2.0
0.85
0.4
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| ACPM-7600-BLK | 功能描述:IC POWER AMP 制造商:broadcom limited 系列:- 零件状态:过期 标准包装:1 |
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