参数资料
型号: AD5320BRMZ
厂商: Analog Devices Inc
文件页数: 8/20页
文件大小: 0K
描述: IC DAC 12BIT R-R W/BUFF 8-MSOP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 50
设置时间: 8µs
位数: 12
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
电压电源: 单电源
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 管件
输出数目和类型: 1 电压,双极
采样率(每秒): 125k
产品目录页面: 782 (CN2011-ZH PDF)
AD5320
Rev. C | Page 16 of 20
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to consider
carefully the power supply and ground return layout on the
board. The printed circuit board containing the AD5320 should
have separate analog and digital sections, each having its own
area of the board. If the AD5320 is in a system where other
devices require an AGND to DGND connection, the connec-
tion should be made at one point only. This ground point
should be as close as possible to the AD5320.
The power supply to the AD5320 should be bypassed with 10 μF
capacitors and 0.1 μF capacitors. The capacitors should be physi-
cally as close as possible to the device with the 0.1 μF capacitors
ideally against the device. The 10 μF capacitors are the tantalum
bead type. It is important that the 0.1 μF capacitors have low
effective series resistance (ESR) and effective series inductance
(ESI), such as common ceramic types of capacitors. The 0.1 μF
capacitors provide a low impedance path to ground for high
frequencies caused by transient currents due to internal logic
switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a two-layer board.
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AD5320BRMZ1 制造商:AD 制造商全称:Analog Devices 功能描述:2.7 V to 5.5 V, 140 ??A, Rail-to-Rail Output 12-Bit DAC in an SOT-23
AD5320BRMZ-REEL 功能描述:IC DAC 12BIT R-R W/BUFF 8-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色产品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 标准包装:91 系列:- 设置时间:4µs 位数:10 数据接口:MICROWIRE?,串行,SPI? 转换器数目:8 电压电源:单电源 功率耗散(最大):2.7mW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-DFN-EP(4x3) 包装:管件 输出数目和类型:8 电压,单极 采样率(每秒):*
AD5320BRMZ-REEL1 制造商:AD 制造商全称:Analog Devices 功能描述:2.7 V to 5.5 V, 140 ??A, Rail-to-Rail Output 12-Bit DAC in an SOT-23
AD5320BRMZ-REEL7 功能描述:IC DAC 12BIT R-R SRL 8MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色产品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 标准包装:91 系列:- 设置时间:4µs 位数:10 数据接口:MICROWIRE?,串行,SPI? 转换器数目:8 电压电源:单电源 功率耗散(最大):2.7mW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-DFN-EP(4x3) 包装:管件 输出数目和类型:8 电压,单极 采样率(每秒):*
AD5320BRMZ-REEL71 制造商:AD 制造商全称:Analog Devices 功能描述:2.7 V to 5.5 V, 140 ??A, Rail-to-Rail Output 12-Bit DAC in an SOT-23