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参数资料
| 型号： | AD5323ARUZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/28页 |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT DUAL R-R 16-TSSOP |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 产品变化通告： | Product Discontinuance 27/Oct/2011 |
| 标准包装： | 1,000 |
| 设置时间： | 8µs |
| 位数： | 12 |
| 数据接口： | 串行 |
| 转换器数目： | 2 |
| 电压电源： | 单电源 |
| 功率耗散（最大）： | 2.5mW |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 带卷 (TR) |
| 输出数目和类型： | 2 电压，单极；2 电压，双极 |
| 采样率（每秒）： | 125k |
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AD5303/AD5313/AD5323
Rev. B | Page 24 of 28
00
47
2-
0
47
SCLK
DIN
DB15
DB0
DB15
DB0
DB15
DB0
SDO
INPUT WORD FOR DAC N
INPUT WORD FOR DAC (N+1)
UNDEFINED
INPUT WORD FOR DAC N
SCLK
SDO
t1
t2
t3
t4
t6
t5
t8
t14
t15
t13
t12
VIL
VIH
SYNC
Figure 47. Daisy-Chaining Timing Diagram
POWER SUPPLY BYPASSING AND GROUNDING
In any circuit where accuracy is important, careful considera-
tion of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the AD5303/AD5313/AD5323 are mounted should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. If the AD5303/
AD5313/AD5323 are in a system where multiple devices
require an AGND-to-DGND connection, the connection
should be made at one point only. The star ground point
should be established as close as possible to the AD5303/
AD5313/AD5323. The AD5303/AD5313/AD5323 should
have ample supply bypassing of 10 μF in parallel with 0.1 μF
on the supply located as close to the package as possible, ideally
right up against the device. Use 10 μF capacitors that are of the
tantalum bead type. The 0.1 μF capacitor should have low
effective series resistance (ESR) and effective series inductance
(ESI), like the common ceramic types that provide a low
impedance path to ground at high frequencies to handle
transient currents due to internal logic switching.
The power supply lines of the AD5303/AD5313/AD5323 should
use as large a trace as possible to provide low impedance paths
and reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other parts of the board, and
should never be run near the reference inputs. Avoid crossover
of digital and analog signals. Traces on opposite sides of the
board should run at right angles to each other. This reduces
the effects of feedthrough through the board. A microstrip
technique is by far the best, but is not always possible with a
double-sided board. In this technique, the component side of
the board is dedicated to the ground plane while signal traces
are placed on the solder side.
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| AD5323BRUZ | 功能描述:IC DAC 12BIT DUAL R-R 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 设置时间:4µs 位数:12 数据接口:串行 转换器数目:2 电压电源:单电源 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-uMAX 包装:管件 输出数目和类型:2 电压，单极 采样率（每秒）:* 产品目录页面:1398 (CN2011-ZH PDF) |
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