参数资料
型号: AD5323BRUZ
厂商: Analog Devices Inc
文件页数: 18/28页
文件大小: 0K
描述: IC DAC 12BIT DUAL R-R 16-TSSOP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 96
设置时间: 8µs
位数: 12
数据接口: 串行
转换器数目: 2
电压电源: 单电源
功率耗散(最大): 2.5mW
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 管件
输出数目和类型: 2 电压,单极;2 电压,双极
采样率(每秒): 125k
产品目录页面: 782 (CN2011-ZH PDF)
AD5303/AD5313/AD5323
Rev. B | Page 25 of 28
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 48. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD5303ARU
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5303ARU-REEL7
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5303BRU
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5303BRU-REEL
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5303BRU-REEL7
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5303BRUZ-REEL71
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5313ARU
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5313ARU-REEL7
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5313BRU
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5313BRU-REEL
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5313BRU-REEL7
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323ARU
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323ARU-REEL7
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323ARUZ-REEL71
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323BRU
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323BRU-REEL
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323BRU-REEL7
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323BRUZ-REEL1
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5323BRUZ-REEL71
–40°C to +105°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
1 Z = RoHS Compliant Part.
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AD5323BRUZ 制造商:Analog Devices 功能描述:D/A CONVERTER (D-A) IC
AD5323BRUZ1 制造商:AD 制造商全称:Analog Devices 功能描述:2.5 V to 5.5 V, 230 ??A, Dual Rail-to-Rail Voltage Output 8-/10-/12-Bit DACs
AD5323BRUZ-REEL 功能描述:IC DAC 12BIT DUAL R-R 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色产品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 标准包装:91 系列:- 设置时间:4µs 位数:10 数据接口:MICROWIRE?,串行,SPI? 转换器数目:8 电压电源:单电源 功率耗散(最大):2.7mW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-DFN-EP(4x3) 包装:管件 输出数目和类型:8 电压,单极 采样率(每秒):*
AD5323BRUZ-REEL1 制造商:AD 制造商全称:Analog Devices 功能描述:2.5 V to 5.5 V, 230 ??A, Dual Rail-to-Rail Voltage Output 8-/10-/12-Bit DACs
AD5323BRUZ-REEL7 功能描述:IC DAC 12BIT DUAL R-R 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色产品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 标准包装:91 系列:- 设置时间:4µs 位数:10 数据接口:MICROWIRE?,串行,SPI? 转换器数目:8 电压电源:单电源 功率耗散(最大):2.7mW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-DFN-EP(4x3) 包装:管件 输出数目和类型:8 电压,单极 采样率(每秒):*