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参数资料
| 型号： | AD532SH |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/17页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLIER 10V TO-100-10 |
| 标准包装： | 1 |
| 功能： | 模拟乘法器/除法器 |
| 位元/级数： | 四象限 |
| 封装/外壳： | TO-100-10 金属罐 |
| 供应商设备封装： | TO-100-10 |
| 包装： | 散装 |
AD532
Rev. D | Page 14 of 16
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
14
1
7
8
0.310 (7.87)
0.220 (5.59)
PIN 1
0.080 (2.03) MAX
0.005 (0.13) MIN
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
0.060 (1.52)
0.015 (0.38)
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.070 (1.78)
0.030 (0.76)
0.100 (2.54)
BSC
0.150
(3.81)
MIN
0.765 (19.43) MAX
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
Figure 20. 14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-14)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
1
20
4
9
8
13
19
14
3
18
BOTTOM
VIEW
0.028 (0.71)
0.022 (0.56)
45° TYP
0.015 (0.38)
MIN
0.055 (1.40)
0.045 (1.14)
0.050 (1.27)
BSC
0.075 (1.91)
REF
0.011 (0.28)
0.007 (0.18)
R TYP
0.095 (2.41)
0.075 (1.90)
0.100 (2.54) REF
0.200 (5.08)
REF
0.150 (3.81)
BSC
0.075 (1.91)
REF
0.358 (9.09)
0.342 (8.69)
SQ
0.358
(9.09)
MAX
SQ
0.100 (2.54)
0.064 (1.63)
0.088 (2.24)
0.054 (1.37)
022
106
-A
Figure 21. 20-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-20-1)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
DIMENSIONS PER JEDEC STANDARDS MO-006-AF
0.500 (12.70)
MIN
0.185 (4.70)
0.165 (4.19)
REFERENCE PLANE
0.050 (1.27) MAX
0.040 (1.02) MAX
0.
3
35
(
8.
51
)
0.
3
05
(
7.
75
)
0.
3
7
0
(9
.4
0
)
0.
3
5
(8
.5
1
)
0.021 (0.53)
0.016 (0.40)
1
0.034 (0.86)
0.025 (0.64)
0.045 (1.14)
0.025 (0.65)
0.160 (4.06)
0.110 (2.79)
6
2
8
7
5
4
3
0.115
(2.92)
BSC
9
10
0.230 (5.84)
BSC
BASE & SEATING PLANE
36° BSC
02
230
6-
A
Figure 22. 10-Pin Metal Header Package [TO-100]
(H-10)
Dimensions shown in inches and (millimeters)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD532SH/883B | 功能描述:增效器/分频器 MULTIPLIER/DIVIDER IC RoHS:否 制造商:Texas Instruments 产品:Multiplier 逻辑系列: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-14 |
| AD532SH883B | 制造商:AD 制造商全称:Analog Devices 功能描述:Internally Trimmed Integrated Circuit Multiplier |
| AD532SO883B | 制造商:AD 功能描述:* |
| AD5330 | 制造商:AD 制造商全称:Analog Devices 功能描述:2.5 V to 5.5 V, 500 uA, Parallel Interface Quad Voltage-Output 8-/10-/12-Bit DACs |
| AD5330_08 | 制造商:AD 制造商全称:Analog Devices 功能描述:2.5 V to 5.5 V, 115 ??A, Parallel Interface Single Voltage-Output 8-/10-/12-Bit DACs |
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