参数资料
型号: AD5391BSTZ-5
厂商: Analog Devices Inc
文件页数: 35/44页
文件大小: 0K
描述: IC DAC 12BIT 16CHAN 3V 52LQFP
产品培训模块: Data Converter Fundamentals
DAC Architectures
产品变化通告: AD5390/1/2 Redesign Change 16/May/2012
设计资源: 8 to 16 Channels of Programmable Voltage with Excellent Temperature Drift Performance Using AD5390/1/2 (CN0029)
AD5390/91/92 Channel Monitor Function (CN0030)
标准包装: 1
设置时间: 6µs
位数: 12
数据接口: I²C,串行
转换器数目: 16
电压电源: 单电源
功率耗散(最大): 35mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 52-LQFP
供应商设备封装: 52-LQFP(10x10)
包装: 托盘
输出数目和类型: 16 电压,单极
采样率(每秒): 167k
配用: EVAL-AD5391EBZ-ND - BOARD EVALUATION FOR AD5391
AD5390/AD5391/AD5392
Data Sheet
Rev. E | Page 40 of 44
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.25
7.10 SQ
6.95
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
06-
13-
2012-
C
Figure 48. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm x 9 mm Body, Very Thin Quad
(CP-64-3)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BCC
TOP VIEW
(PINS DOWN)
40
52
1
14
13
26
27
39
0.65
BSC
LEAD PITCH
0.38
0.32
0.22
1.60
MAX
0.75
0.60
0.45
VIEW A
PIN 1
0.20
0.09
1.45
1.40
1.35
0.10
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
3.5°
0.15
0.05
12.20
12.00 SQ
11.80
10.20
10.00 SQ
9.80
051706-
A
Figure 49. 52-Lead Low Profile Quad Flat Package [LQFP]
(ST-52)
Dimensions shown in millimeters
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