参数资料
型号: AD5412AREZ-REEL7
厂商: Analog Devices Inc
文件页数: 3/44页
文件大小: 0K
描述: IC DAC 12BIT SER 24-TSSOP
产品培训模块: DAC Architectures
设计资源: Simplified 12-Bit Voltage and 4 mA-to-20 mA Output Solution Using AD5412 (CN0097)
标准包装: 1,000
设置时间: 25µs
位数: 12
数据接口: MICROWIRE?,串行,SPI?
转换器数目: 1
电压电源: 模拟和数字,双 ±
功率耗散(最大): 128mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm)裸露焊盘
供应商设备封装: 24-TSSOP 裸露焊盘
包装: 带卷 (TR)
输出数目和类型: 1 电流,单极;1 电流,双极;1 电压,单极;1 电压,双极
采样率(每秒): 40k
Data Sheet
AD5412/AD5422
Rev. I | Page 11 of 44
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
80 mA do not cause SCR latch-up.
Table 5.
Parameter
Rating
AVDD to GND
0.3 V to +48 V
AVSS to GND
+0.3 V to 28 V
AVDD to AVSS
0.3 V to +60 V
DVCC to GND
0.3 V to +7 V
Digital Inputs to GND
0.3 V to DVCC + 0.3 V or 7 V
(whichever is less)
Digital Outputs to GND
0.3 V to DVCC + 0.3 V or 7 V
(whichever is less)
REFIN/REFOUT to GND
0.3 V to +7 V
VOUT to GND
AVSS to AVDD
IOUT to GND
0.3 V to AVDD
Operating Temperature Range (TA)
Industrial1
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
125°C
24-Lead TSSOP_EP Package
θJA Thermal Impedance2
35°C/W
40-Lead LFCSP Package
θJA Thermal Impedance2
33°C/W
Power Dissipation
(TJ max – TA)/θJA
Lead Temperature
JEDEC industry standard
Soldering
J-STD-020
ESD (Human Body Model)
2 kV
1
Power dissipated on chip must be derated to keep the junction temperature
below 125°C, assuming that the maximum power dissipation condition is
sourcing 24 mA into GND from IOUT with a 4 mA on-chip current.
2
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with thermal vias. See JEDEC JESD51.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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