参数资料
型号: AD5424YRU
厂商: Analog Devices Inc
文件页数: 23/29页
文件大小: 0K
描述: IC DAC 8BIT MULTIPLYING 16-TSSOP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 96
设置时间: 30ns
位数: 8
数据接口: 并联
转换器数目: 1
电压电源: 单电源
功率耗散(最大): 25µW
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 管件
输出数目和类型: 2 电流,单极;2 电流,双极
采样率(每秒): 20.4M
配用: EVAL-AD5424EBZ-ND - BOARD EVALUATION FOR AD5424
AD5424/AD5433/AD5445
Data Sheet
Rev. D | Page 2 of 28
TABLE OF CONTENTS
REVISION HISTORY
/13—Rev. C to Rev. D
Changes to Figure 4 and Table 4..................................................... 7
Changes to Figure 6 and Table 5..................................................... 8
Changes to Figure 8 and Table 6..................................................... 9
Updated Outline Dimensions....................................................... 25
Changes to Ordering Guide .......................................................... 26
12/12—Rev. B to Rev. C
Changes to General Description Section ...................................... 1
Added Note 2 to Table 1 .................................................................. 4
Added EPAD Note to Table 4 and EPAD Note to Figure 4......... 7
Added EPAD Note to Table 5 and EPAD Note to Figure 6......... 8
Added EPAD Note to Table 6 and EPAD Note to Figure 8......... 9
Deleted the Evaluation Board for AD5424/AD5433/AD5445
Section and Power Supplies for Evaluation Board Section....... 23
Deleted Figure 59; Renumbered Sequentially............................. 24
Deleted Figure 60 and Figure 61................................................... 25
Changes to Ordering Guide .......................................................... 26
Deleted Figure 62 and Table 12; Renumbered Sequentially ..... 26
8/09—Rev. A to Rev. B
Updated Outline Dimensions....................................................... 28
Changes to Ordering Guide.......................................................... 29
3/05—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changes to Specifications.................................................................4
Changes to Figure 49...................................................................... 17
Changes to Figure 50...................................................................... 18
Changes to Figure 51, Figure 52, and Figure 54......................... 19
Added Microprocessor Interfacing Section................................ 22
Added Figure 59 ............................................................................. 24
Added Figure 60 ............................................................................. 25
10/03—Initial Version: Revision 0
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