参数资料
| 型号： | AD5541ABRMZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 19/20页 |
| 文件大小： | 0K |
| 描述： | IC DAC 16BIT 2.7-5.5V 10-MSOP |
| 标准包装： | 50 |
| 系列： | nanoDAC™ |
| 设置时间： | 1µs |
| 位数： | 16 |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 功率耗散（最大）： | 825µW |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
| 输出数目和类型： | * |
| 采样率（每秒）： | 1M |
AD5541A
Rev. A | Page 8 of 20
08
51
6-
0
04
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
3
SCLK
4
DIN
1
REF
2
CS
6VOUT
5CLR
8GND
7VDD
TOP VIEW
(Not to Scale)
AD5541A-1
Figure 5. AD5541A-1 8-Lead LFCSP Pin Configuration
08
51
6-
0
05
1
VDD
2
VOUT
3
AGND
4
REF
5
10 VLOGIC
9DGND
8
7DIN
6SCLK
TOP VIEW
(Not to Scale)
AD5541A
CS
LDAC
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
Figure 6. AD5541A 10-Lead LFCSP Pin Configuration
Table 7. AD5541A-1 and AD5541A Pin Function Descriptions
Pin No.
8-Lead LFCSP
10-Lead LFCSP
Mnemonic
Description
1
4
REF
Voltage Reference Input for the DAC. Connect to an external 2.5 V reference. The
reference can range from 2 V to VDD.
2
5
CS
Logic Input Signal. The chip select signal is used to frame the serial data input.
3
6
SCLK
Clock Input. Data is clocked into the serial input register on the rising edge of SCLK.
Duty cycle must be between 40% and 60%.
4
7
DIN
Serial Data Input. This device accepts 16-bit words. Data is clocked into the serial input
register on the rising edge of SCLK.
5
CLR
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all
LDAC pulses are ignored. When CLR is activated, the serial input register and the DAC
register are cleared to zero scale.
6
2
VOUT
Analog Output Voltage from the DAC.
9
DGND
Digital Ground. Ground reference for digital circuitry.
7
1
VDD
Analog Supply Voltage.
8
GND
Ground Reference Point for Both Analog and Digital Circuitry.
3
AGND
Ground Reference Point for Analog Circuitry.
10
VLOGIC
Logic Power Supply.
8
LDAC
LDAC Input. When this input is taken low, the DAC register is simultaneously updated
with the contents of the serial input register.
EPAD
Exposed Pad. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, GND.
1 N/A means not applicable.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD5541ABRMZ-REEL7 | 功能描述:IC DAC 16BIT 2.7-5.5V 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:nanoDAC™ 标准包装:47 系列:- 设置时间:2µs 位数:14 数据接口:并联 转换器数目:1 电压电源:单电源 功率耗散（最大）:55µW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SSOP（0.209"，5.30mm 宽） 供应商设备封装:28-SSOP 包装:管件 输出数目和类型:1 电流，单极；1 电流，双极 采样率（每秒）:* |
| AD5541AR | 功能描述:IC DAC 16BIT SRL IN/VOUT 8-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:nanoDAC™ 产品培训模块:Data Converter Fundamentals DAC Architectures 标准包装:750 系列:- 设置时间:7µs 位数:16 数据接口:并联 转换器数目:1 电压电源:双 ± 功率耗散（最大）:100mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-LCC（J 形引线） 供应商设备封装:28-PLCC（11.51x11.51） 包装:带卷 (TR) 输出数目和类型:1 电压，单极；1 电压，双极 采样率（每秒）:143k |
| AD5541AR-REEL7 | 功能描述:IC DAC 16BIT SERIAL-IN 8-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:nanoDAC™ 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| AD5541ARZ | 功能描述:IC DAC 16BIT SERIAL IN 8-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:nanoDAC™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 设置时间:4µs 位数:12 数据接口:串行 转换器数目:2 电压电源:单电源 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-uMAX 包装:管件 输出数目和类型:2 电压，单极 采样率（每秒）:* 产品目录页面:1398 (CN2011-ZH PDF) |
| AD5541ARZ | 制造商:Analog Devices 功能描述:IC DAC 16BIT 1.5MSPS SOIC-8 |
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